Test Structures for the Characterization of MEMS and CMOS Integration Technology
Huamao Lin, Walton, A.J., Dunare, C.C., Stevenson, J., Gundlach, A.M., Smith, S., Bunting, A.S.
Published in IEEE transactions on semiconductor manufacturing (01.05.2008)
Published in IEEE transactions on semiconductor manufacturing (01.05.2008)
Get full text
Journal Article
Test chip for the development and evaluation of sensors for measuring stress in metal interconnects
Terry, J.G., Smith, S., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M., Horsfall, A.B., Kai Wang, dos Santos, J.M.M., Soare, S.M., Wright, N.G., O'Neill, A.G., Bull, S.J.
Published in IEEE transactions on semiconductor manufacturing (01.05.2005)
Published in IEEE transactions on semiconductor manufacturing (01.05.2005)
Get full text
Journal Article
Conference Proceeding
Extraction of Sheet Resistance and Line Width From All-Copper ECD Test Structures Fabricated From Silicon Preforms
Shulver, B.J.R., Bunting, A.S., Gundlach, A.M., Haworth, L.I., Ross, A., Smith, S., Snell, A.J., Stevenson, J., Walton, A.J., Allen, R., Cresswell, M.W.
Published in IEEE transactions on semiconductor manufacturing (01.11.2008)
Published in IEEE transactions on semiconductor manufacturing (01.11.2008)
Get full text
Journal Article
Conference Proceeding
Electrical characterization of platinum deposited by focused ion beam
Smith, S., Walton, A.J., Bond, S., Ross, A.W.S., Stevenson, J.T.M., Gundlach, A.M.
Published in IEEE transactions on semiconductor manufacturing (01.05.2003)
Published in IEEE transactions on semiconductor manufacturing (01.05.2003)
Get full text
Journal Article
Conference Proceeding
Null holographic test structures for the measurement of overlay and its statistical variation
AbuGhazaleh, S.A., Christie, P., Agrawal, V., Stevenson, J.T.M., Walton, A.J., Gundlach, A.M., Smith, S.
Published in IEEE transactions on semiconductor manufacturing (01.05.2000)
Published in IEEE transactions on semiconductor manufacturing (01.05.2000)
Get full text
Journal Article
Reactive ion etching of zinc oxide (ZnO) in SiCl 4 based plasmas
Mastropaolo, E., Gundlach, A.M., Fragkiadakis, C., Kirby, P.B., Cheung, R.
Published in Electronics letters (06.12.2007)
Published in Electronics letters (06.12.2007)
Get full text
Journal Article
Development of a miniaturised drug delivery system with wireless power transfer and communication
Smith, S, Tang, T B, Terry, J G, Stevenson, J T M, Flynn, B W, Reekie, H M, Murray, A F, Gundlach, A M, Renshaw, D, Dhillon, B, Ohtori, A, Inoue, Y, Walton, A J
Published in IET nanobiotechnology (01.10.2007)
Published in IET nanobiotechnology (01.10.2007)
Get more information
Journal Article
Direct Al–Al contact using low temperature wafer bonding for integrating MEMS and CMOS devices
Lin, H., Stevenson, J.T.M., Gundlach, A.M., Dunare, C.C., Walton, A.J.
Published in Microelectronic engineering (01.05.2008)
Published in Microelectronic engineering (01.05.2008)
Get full text
Journal Article
Conference Proceeding
Implementation of wireless power transfer and communications for an implantable ocular drug delivery system
Tang, T B, Smith, S, Flynn, B W, Stevenson, J T M, Gundlach, A M, Reekie, H M, Murray, A F, Renshaw, D, Dhillon, B, Ohtori, A, Inoue, Y, Terry, J G, Walton, A J
Published in IET nanobiotechnology (01.09.2008)
Published in IET nanobiotechnology (01.09.2008)
Get more information
Journal Article
An evaluation of test structures for measuring the contact resistance of 3-D bonded interconnects
Lin, H., Smith, S., Stevenson, J.T.M., Gundlach, A.M., Dunare, C.C., Walton, A.J.
Published in 2008 IEEE International Conference on Microelectronic Test Structures (01.03.2008)
Published in 2008 IEEE International Conference on Microelectronic Test Structures (01.03.2008)
Get full text
Conference Proceeding
Fabrication of prototype imaging arrays for SCUBA-2
Hilton, G.C., Beall, J.A., Doriese, W.B., Duncan, W.D., Ferreira, L.S., Irwin, K.D., Reintsema, C.D., Ullom, J.N., Vale, L.R., Xu, Y., Zink, B.L., Parkes, W., Bunting, A.S., Dunare, C.C., Gundlach, A.M., Stevenson, J.T.M., Walton, A.J., Schulte, E., Corrales, E., Sienicki, J.P., Bintley, Dan, Ade, P.A.R., Sudiwala, Rashmi V., Woodcraft, Adam L., Halpern, Mark, Holland, W., Audley, M.D., MacIntosh, M.
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (15.04.2006)
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (15.04.2006)
Get full text
Journal Article
Dependence of process parameters on stress generation in aluminum thin films
Horsfall, A.B., Kai Wang, dos-Santos, J.M.M., Soare, S.M., Bull, S.J., Wright, N.G., O'Neill, A.G., Terry, J.G., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M.
Published in IEEE transactions on device and materials reliability (01.09.2004)
Published in IEEE transactions on device and materials reliability (01.09.2004)
Get full text
Magazine Article
Direct measurement of residual stress in integrated circuit interconnect features
Horsfall, A.B., dos Santos, J.M.M., Soare, S.M., Wright, N.G., O’Neill, A.G., Bull, S.J., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M.
Published in Microelectronics and reliability (01.09.2003)
Published in Microelectronics and reliability (01.09.2003)
Get full text
Journal Article
Techniques to improve the flatness of reflective micro-optical arrays
Seunarine, K, Calton, D.W, Underwood, I, Stevenson, J.T.M, Gundlach, A.M, Begbie, M
Published in Sensors and actuators. A. Physical. (1999)
Published in Sensors and actuators. A. Physical. (1999)
Get full text
Journal Article
Test structures for the characterisation of MEMS and CMOS integration technology
Lin, H., Walton, A.J., Dunarc, C.C., Stevenson, J.T.M., Gundlach, A.M., Smith, S., Bunting, A.S.
Published in 2006 IEEE International Conference on Microelectronic Test Structures (2006)
Published in 2006 IEEE International Conference on Microelectronic Test Structures (2006)
Get full text
Conference Proceeding
Extraction of Sheet Resistance and Linewidth from All-Copper ECD Test Structures Fabricated from Silicon Preforms
Shulver, B.J.R., Bunting, A.S., Gundlach, A.M., Haworth, L.I., Ross, A.W.S., Smith, S., Snell, A.J., Stevenson, J.T.M., Walton, A.J., Allen, R.A., Cresswell, M.W.
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Get full text
Conference Proceeding
Calibration of MEMS-based test structures for predicting thermomechanical stress in integrated circuit interconnect structures
dos-Santos, J.M.M., Kai Wang, Horsfall, A.B., Pina, J.C.P., Wright, N.G., O'Neill, A.G., Soare, S.M., Bull, S.J., Terry, J.G., Walton, A.J., Gundlach, A.M., Stevenson, J.T.M.
Published in IEEE transactions on device and materials reliability (01.12.2005)
Published in IEEE transactions on device and materials reliability (01.12.2005)
Get full text
Magazine Article
Array Based Test Structure for Optical-Electrical Overlay Calibration
Shulver, B.J.R., Allen, R.A., Walton, A.J., Cresswell, M.W., Stevenson, J.T.M., Smith, S., Bunting, A.S., Dunare, C., Gundlach, A.M., Haworth, L.I., Ross, A.W.S., Snell, A.J.
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Get full text
Conference Proceeding