Characterization of copper voids in damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Corum, D.L., Oestreich, S., Sherman, K., Lin, J.H., Fiordalice, R.
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
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Journal Article
Automation of wafer handling in legacy semiconductor fab-a true cultural change
Guldi, R.L., Whitfield, M.T., Paradis, D.E., Poag, F.D., Jensen, D.P.
Published in 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings (1997)
Published in 1997 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop ASMC 97 Proceedings (1997)
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Conference Proceeding
Characterization of copper voids in dual damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Oestreich, S., Davis, K., Fiordalice, R.
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
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Conference Proceeding
Strategy and metrics for wafer handling automation in legacy semiconductor fab
Guldi, R.L., Paradis, D.E., Whitfield, M.T., Poag, F.D., Jensen, D.P.
Published in IEEE transactions on semiconductor manufacturing (01.02.1999)
Published in IEEE transactions on semiconductor manufacturing (01.02.1999)
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Journal Article
Conference Proceeding
A multi-pronged approach to defect management
Paradis, D.E., Guldi, R.L., Lalena, J.N., Ritchison, J.W.
Published in Proceedings of International Symposium on Semiconductor Manufacturing (1995)
Published in Proceedings of International Symposium on Semiconductor Manufacturing (1995)
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Conference Proceeding
Nickel SALICIDE Process Technology for CMOS Devices of 90nm Node and Beyond
Lu, J.P., Miles, D.S., DeLoach, J., Yue, D.F., Chen, P.J., Bonifield, T., Crank, S., Yu, S.F., Mehrad, F., Obeng, Y., Ramappa, D.A., Corum, D., Guldi, R.L., Robertson, L.S., Liu, X., Hall, L.H., Xu, Y.Q., Lin, B.Y., Griffin, A.F.Jr, Johnson, F.S., Grider, T., Mercer, D., Montgomery, C.
Published in 2006 International Workshop on Junction Technology (2006)
Published in 2006 International Workshop on Junction Technology (2006)
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Conference Proceeding
Understanding and eliminating defects in electroplated Cu films
Lu, J.P., Chen, L., Gonzalez, D., Guo, H.L., Rose, D.J., Marudachalam, M., Hsu, W.U., Liu, H.Y., Cataldi, F., Chatterjee, B., Smith, P.B., Holverson, P., Guldi, R.L., Russell, N.M., Shinn, G., Zuhoski, S., Luttmer, J.D.
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
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Conference Proceeding