Gold-Gold Interconnects to Copper Pillar using fast Thermal Compression Bonding using Non-conductive paste
Frye, D, Guino, R, Gupta, S, Sano, M, Sato, K, Iida, K
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
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Conference Proceeding
Advanced underfill materials
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Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Wafer applied and no flow underfill screening for 3D stacks
Rebibis, K. J., Gerets, C., Capuz, G., Daily, R., Wang, T., LaManna, A., Duval, F., Miller, A., Guino, R., Peddi, R., Beyne, E., Swinnen, B.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Achievement of low temperature chip stacking by a wafer-applied underfill material
Ren-Shin Cheng, Kuo-Shu Kao, Jing-Yao Chang, Yin-Po Hung, Tsung-Fu Yang, Yu-Wei Huang, Su-Mei Chen, Tao-Chih Chang, Qiaohong Huang, Guino, R., Hoang, G., Jie Bai, Becker, K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
When farmers do not adopt: the case of basal-N vs. farmer practice
Fujisaka, S, Guino, R, Cenas, P, Obusan, M, Ardales, E. (International Rice Research Inst., Los Banos, Laguna (Philippines). Social Sciences Div.)
Published in Philippine Journal of Crop Science (Philippines) (01.05.1992)
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Published in Philippine Journal of Crop Science (Philippines) (01.05.1992)
Journal Article