Comparative Life Cycle Analysis of Redistribution Layer for 3D Integrations
Guillou, Suzanne, Saint-Patrice, Damien, Vauche, Laura, Castagne, Laetitia, Moreau, Stephane, Velard, Remi, Di Cioccio, Lea
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
Get full text
Conference Proceeding
Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling
Garnier, Arnaud, Castagne, Laetitia, Moreau, Stephane, Fraczkiewicz, Alexandra, Monniez, Theo, Mermin, Daniel, Guillou, Suzanne, Vauche, Laura, Saint-Patrice, Damien, Coudrain, Perceval
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding