A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
Boeuf, F., Cremer, S., Vulliet, N., Pinguet, T., Mekis, A., Masini, G., Verslegers, L., Sun, P., Ayazi, A., Hon, N-K, Sahni, S., Chi, Y., Orlando, B., Ristoiu, D., Farcy, A., Leverd, F., Broussous, L., Pelissier-Tanon, D., Richard, C., Pinzelli, L., Beneyton, R., Gourhant, O., Gourvest, E., Le-Friec, Y., Monnier, D., Brun, P., Guillermet, M., Benoit, D., Haxaire, K., Manouvrier, J. R., Jan, S., Petiton, H., Carpentier, J. F., Quemerais, T., Durand, C., Gloria, D., Fourel, M., Battegay, F., Sanchez, Y., Batail, E., Baron, F., Delpech, P., Salager, L., De Dobbelaere, P., Sautreuil, B.
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
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Journal Article
Plasma etch challenges at 14nm and beyond technology nodes in the BEOL
Brun, Ph, Bailly, F., Guillermet, M., Aparico, E., Posseme, N.
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Temperature impact (up to 200 °C) on performance and reliability of HfO2-based RRAMs
Cabout, T., Perniola, L., Jousseaume, V., Grampeix, H., Nodin, J. F., Toffoli, A., Guillermet, M., Jalaguier, E., Vianello, E., Molas, G., Reimbold, G., De Salvo, B., Diokh, T., Candelier, P., Pirrotta, O., Padovani, A., Larcher, L., Bocquet, M., Muller, C.
Published in 2013 5th IEEE International Memory Workshop (01.05.2013)
Published in 2013 5th IEEE International Memory Workshop (01.05.2013)
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Conference Proceeding
Plasma induced damage investigation in the fully depleted SOI technology
Akbal, M., Ribes, G., Guillermet, M., Vallier, L.
Published in 2015 International Conference on IC Design & Technology (ICICDT) (01.06.2015)
Published in 2015 International Conference on IC Design & Technology (ICICDT) (01.06.2015)
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Conference Proceeding
Effect of SET temperature on data retention performances of HfO2-based RRAM cells
Cabout, T., Vianello, E., Jalaguier, E., Grampeix, H., Molas, G., Blaise, P., Cueto, O., Guillermet, M., Nodin, J. F., Pemiola, L., Blonkowski, S., Jeannot, S., Denorme, S., Candelier, P., Bocquet, M., Muller, C.
Published in 2014 IEEE 6th International Memory Workshop (IMW) (01.05.2014)
Published in 2014 IEEE 6th International Memory Workshop (IMW) (01.05.2014)
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Investigation of the impact of the oxide thickness and RESET conditions on disturb in HfO2-RRAM integrated in a 65nm CMOS technology
Diokh, T., Le-Roux, E., Jeannot, S., Gros-Jean, M., Candelier, P., Nodin, J. F., Jousseaume, V., Perniola, L., Grampeix, H., Cabout, T., Jalaguier, E., Guillermet, M., De Salvo, B.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Etching process scalability and challenges for ULK materials
Chevolleau, T, Posseme, N, David, T, Bouyssou, R, Ducote, J, Bailly, F, Darnon, M, El Kodadi, M, Besacier, M, Licitra, C, Guillermet, M, Ostrovsky, A, Verove, C, Joubert, O
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Impact of Si/Al implantation on the forming voltage and pre-forming conduction modes in HfO2 based OxRAM cells
Barlas, M., Traore, B., Grenouillet, L., Bernasconi, S., Blaise, P., Alayan, M., Sklenard, B., Jalaguier, E., Rodriguez, P., Mazen, F., Vilain, E., Guillermet, M., Jeannot, S., Vianello, E., Perniola, L.
Published in 2016 46th European Solid-State Device Research Conference (ESSDERC) (01.09.2016)
Published in 2016 46th European Solid-State Device Research Conference (ESSDERC) (01.09.2016)
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Conference Proceeding
Porous SiOCH Integration: Etch Challenges with a Trench First Metal Hard Mask Approach
Possémé, Nicolas, David, Thibaut, Chevolleau, Thierry, Darnon, Maxime, Brun, Philippe, Guillermet, Marc, Oddou, Jean Pierre, Barnola, Sebastien, Bailly, Fanny, Bouyssou, Regis, Ducote, Julien, Hurand, Romain, Vérove, Christophe, Joubert, Olivier
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Optical Phased Array for 905-nm LIDAR applications integrated on 300mm Si-Photonic Platform
Monfray, S., Guerber, S., Montagne, A., Fowler, D., Grosse, P., Planchot, J., Ristoiu, D., Baron, F., Brihoum, M., Babaud, L., Taute, A., Kempf, E., Rovayaz, K., Chantraine, P., Delmedico, S., Leverd, F., Balme, L., Pellissier, D., Haxaire, K., Guillermet, M., Mermoz, S., Hello, M., Jan, S., Chevalier, P., Boeuf, F.
Published in 2022 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2022)
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Published in 2022 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2022)
Conference Proceeding
3D sequential integration with Si CMOS stacked on 28nm industrial FDSOI with Cu-ULK iBEOL featuring RO and HDR pixel
Mota-Frutuoso, T., Lapras, V., Brunet, L., Basset, L., Lugo, J., Fenouillet-Beranger, C., Vinet, M., Lattard, D., Boulard, F., Exbraya, Y., Boutry, D., Billoint, O., Bosch, D., Maneglia, Y., Peizerat, A., Dumas, S., Sicard, G., Kerdiles, S., Kanyandekwe, J., Sideris, P., Mazzocchi, V., Sarrazin, A., Loup, V., Mauguen, G., Morales, C., Alba, P. Acosta, Balan, V., Perrot, C., Sturm, J., Euvrard, C., Aussenac, F., Janaud, A., Chapon, J-D., Guillermet, M., Guglieri, S., Bailly, F., Toresani, P., Fournel, F., Mouhdach, M., Berthoud, A., Chapelon, L-L., Ribotta, M., Ponthenier, F., Magalhaes, A., Maitrejean, S., Moulin, C., Michailos, J., Arnaud, F., Cathelin, A., Arcamone, J., Andrieu, F., Garros, X., Gaillard, F., Batude, P.
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
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A 55 nm triple gate oxide 9 metal layers SiGe BiCMOS technology featuring 320 GHz fT / 370 GHz fMAX HBT and high-Q millimeter-wave passives
Chevalier, P., Avenier, G., Ribes, G., Montagne, A., Canderle, E., Celi, D., Derrier, N., Deglise, C., Durand, C., Quemerais, T., Buczko, M., Gloria, D., Robin, O., Petitdidier, S., Campidelli, Y., Abbate, F., Gros-Jean, M., Berthier, L., Chapon, J. D., Leverd, F., Jenny, C., Richard, C., Gourhant, O., De-Buttet, C., Beneyton, R., Maury, P., Joblot, S., Favennec, L., Guillermet, M., Brun, P., Courouble, K., Haxaire, K., Imbert, G., Gourvest, E., Cossalter, J., Saxod, O., Tavernier, C., Foussadier, F., Ramadout, B., Bianchini, R., Julien, C., Ney, D., Rosa, J., Haendler, S., Carminati, Y., Borot, B.
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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1.62\mu \mathrm Global Shutter Quantum Dot Image Sensor Optimized for Near and Shortwave Infrared
Steckel, J. S., Josse, E., Pattantyus-Abraham, A. G., Bidaud, M., Mortini, B., Bilgen, H., Arnaud, O., Allegret-Maret, S., Saguin, F., Mazet, L., Lhostis, S., Berger, T., Haxaire, K., Chapelon, L. L., Parmigiani, L., Gouraud, P., Brihoum, M., Bar, P., Guillermet, M., Favreau, S., Duru, R., Fantuz, J., Ricq, S., Ney, D., Hammad, I., Roy, D., Arnaud, A., Vianne, B., Nayak, G., Virollet, N., Farys, V., Malinge, P., Tournier, A., Lalanne, F., Crocherie, A., Galvier, J., Rabary, S., Noblanc, O., Wehbe-Alause, H., Acharya, S., Singh, A., Meitzner, J., Aher, D., Yang, H., Romero, J., Chen, B., Hsu, C., Cheng, K. C., Chang, Y., Sarmiento, M., Grange, C., Mazaleyrat, E., Rochereau, K.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
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Conference Proceeding
Optimization of CVD dielectric process to achieve reliable ultra low-k air gaps
ARNAL, Vincent, TORRES, Joaquin, REYNARD, Jean-Philippe, GAYET, Philippe, VEROVE, Christophe, GUILLERMET, Marc, SPINELLI, Philippe
Published in Microelectronic engineering (2002)
Published in Microelectronic engineering (2002)
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Journal Article
Manufacturability and Speed Performance Demonstration of Porous ULK (k=2.5) for a 45nm CMOS Platform
Richard, E., Mellier, M., Petitdidier, S., Delsol, R., Besling, W., Marinier, L., Imbert, G., Lagha, A., Broussous, L., Rasco, M., Cregut, C., Fox, R., Downey, S., Huang, G., Haond, M., Cave, N., Perera, A., Monget, C., Zaleski, M., Ferreira, P., Guvenilir, A., Brun, P., Ollier, E., Guillermet, M.
Published in 2007 IEEE Symposium on VLSI Technology (01.06.2007)
Published in 2007 IEEE Symposium on VLSI Technology (01.06.2007)
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Conference Proceeding
In situ post etching treatment as a solution to improve defect density for porous low-k integration using metallic hard masks
Posseme, N., Bouyssou, R., Chevolleau, T., David, T., Arnal, V., Chhun, S., Monget, C., Richard, E., Galpin, D., Guillan, J., Arnaud, L., Roy, D., Guillermet, M., Ramard, J., Joubert, O., Verove, C.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
New etch challenges for the 65-nm technology node Low-k integration using An enhanced Trench First Hard Mask architecture
Posseme, N., Maurice, C., Brun, Ph, Oilier, E., Guillermet, M., Verove, C., Berger, T., Fox, T., Hinsinger, O.
Published in 2006 International Interconnect Technology Conference (2006)
Published in 2006 International Interconnect Technology Conference (2006)
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Conference Proceeding
High performance k=2.5 ULK backend solution using an improved TFHM architecture, extendible to the 45nm technology node
Fox, R., Hinsinger, O., Richard, E., Sabouret, E., Berger, T., Goldberg, C., Humbert, A., Imbert, G., Brun, P., Ollier, E., Maurice, C., Guillermet, M., Monget, C., Plantier, V., Bono, H., Zaleski, M., Mellier, M., Jacquemin, J.P., Flake, J., Sharma, B.G., Broussous, L., Farcy, A., Arnal, V., Gonella, R., Maubert, S., Girault, V., Vannier, P., Reber, D., Schussler, A., Mueller, J., Besling, W.
Published in IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest (2005)
Published in IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest (2005)
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Dual damascene architectures evaluation for the 0.18 /spl mu/m technology and below
Verove, C., Descouts, B., Gayet, P., Guillermet, M., Sabouret, E., Spinelli, E., Van der Vegt, E.
Published in Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) (2000)
Published in Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) (2000)
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Conference Proceeding
Integration of a 3 level Cu-SiO/sub 2/ air gap interconnect for sub 0.1 micron CMOS technologies
Arnal, V., Torres, J., Gayet, P., Gonella, R., Spinelli, P., Guillermet, M., Reynard, J.-P., Verove, C.
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
Published in Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) (2001)
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