TiO2—graphene nanocomposites for photocatalytic hydrogen production from splitting water
Cheng, Ping, Yang, Zhi, Wang, Hong, Cheng, Wei, Chen, Mingxia, Shangguan, Wenfeng, Ding, Guifu
Published in International journal of hydrogen energy (01.02.2012)
Published in International journal of hydrogen energy (01.02.2012)
Get full text
Journal Article
A Single‐Droplet Electricity Generator Achieves an Ultrahigh Output Over 100 V Without Pre‐Charging
Zhang, Qi, Li, Yahui, Cai, Han, Yao, Mingfang, Zhang, Haodong, Guo, Linqi, Lv, Zhenjie, Li, Mengqiu, Lu, Xichi, Ren, Chao, Zhang, Penglei, Zhang, Yanxin, Shi, Xian, Ding, Guifu, Yao, Jinyuan, Yang, Zhuoqing, Wang, Zhong Lin
Published in Advanced materials (Weinheim) (01.12.2021)
Published in Advanced materials (Weinheim) (01.12.2021)
Get full text
Journal Article
Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs)
Zhang, Yazhou, Ding, Guifu, Wang, Hong, Cheng, Ping
Published in Journal of the Electrochemical Society (01.01.2015)
Published in Journal of the Electrochemical Society (01.01.2015)
Get full text
Journal Article
Reinforcement mechanisms and current research status of silicon carbide whisker-reinforced composites: A comprehensive review
Lai, Liyan, Bi, Yuxiao, Niu, Bing, Yu, Guanliang, Li, Yigui, Ding, Guifu, Xu, Qiu
Published in Reviews on advanced materials science (31.07.2024)
Published in Reviews on advanced materials science (31.07.2024)
Get full text
Journal Article
Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like Nano/Microstructure Array
Wu, Yongjin, Ding, Guifu, Zhu, Yuan, Wang, Yan, Liu, Rui, Sun, Yunna
Published in Polymers (17.02.2023)
Published in Polymers (17.02.2023)
Get full text
Journal Article
Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method
Zhang, Yazhou, Sun, Yunna, Ding, Guifu, Wang, Yan, Wang, Hong, Cheng, Ping
Published in Journal of the Electrochemical Society (01.01.2015)
Published in Journal of the Electrochemical Society (01.01.2015)
Get full text
Journal Article
SiC nanowire-based SU-8 with enhanced mechanical properties for MEMS structural layer design
Yang, Yu, Lai, Liyan, Ding, Guifu, Chen, Ting
Published in Na mi ji shu yu jing mi gong cheng (01.12.2019)
Published in Na mi ji shu yu jing mi gong cheng (01.12.2019)
Get full text
Journal Article
Application of Ni/SiCw Composite Material in MEMS Microspring
Lai, Liyan, Yu, Guanliang, Wang, Guilian, Li, Yigui, Ding, Guifu, Yang, Zhuoqing
Published in Micromachines (Basel) (01.09.2023)
Published in Micromachines (Basel) (01.09.2023)
Get full text
Journal Article