Influence of Al/CucorAl wire bonding on reliability of SiC devices
Fang, Chao, Tang, Xiang, Qin, Guangyuan, Ke, Haotao, Wu, Yibo, Zhang, Jing, Chang, Guiqin, Luo, Haihui
Published in 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (25.08.2021)
Published in 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (25.08.2021)
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Conference Proceeding
BIOMARKER OF EXCESS HEAT SHANGHUO (UPPER FEVER) SYNDROME INTERVENED BY HUANGLIAN JIEDU PILLS AND APPLICATION THEREOF
SI Nan, QIN Guangyuan, LUO Keke, WU Guihui, CHEN Yunqin, WEI Xiaolu, BIAN Baolin, ZHAO Haiyu, WANG Hongjie, WU Dan, ZHOU Yanyan, YANG Jian
Year of Publication 31.05.2023
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Year of Publication 31.05.2023
Patent