Optimization of the CMP process for direct wafer-to-wafer oxide bonding
Ji, Hong-Miao, Cheemalamarri, Hemanth Kumar, Chi, Ting-Ta, Serene, Hui-ting Lim, Teo Dickson, Wei-Jie, Alfred, Siang-Kiat Neo, Li, Hong-Yu, Jon, Gim-Guan Chen, Venkataraman, Nandini, Lee, Wen
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
Roy, Sangita Chaki, Guan, Chen Gim, Venkataraman, Nandini, Lee, Wen, Singh, Navab
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications
Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Electrical Characterization and Reliability Studies of Nano-TSV
Tseng, Ya-Ching, Chui, King-Jien, Goh, Simon Chun Kiat, Lau, Daniel, Li, Hongyu, Anh, Tran Van Nhat, Yu, Haitao, Tew, Chin Khang, Chen, Gim Guan, Varghese, Binni, Ming, Calvin Chua Hung
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Sandra, San, Van Nhat Anh, Tran, Chandra Rao, Bhesetti, Guan, Chen Gim, Haitao, Yu, Raju, Mani, Ping, Luo, Chaeeun, Lee, Rao, Vempati Srinivasa, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Dishing study of polyimide CMP process
Yingjun Mao, Gim Guan Chen, Murthy, R., Tan, Eugene, Woon Leng Loh
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding
Ji, Hong Miao, Chen, Gim Guan, Chui, K.-J.
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Process Development and Integration for Wafer-to-Wafer Hybrid Bonding
Li, Hongyu, Ji, Hong Miao, Chen, Gim Guan, Siang Kiat, Alfred Neo, Jie Dickson, Teo Wei, Chui, K.-J.
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding