Effects of heat treatment processes on the microstructures and properties of powder metallurgy produced Cu–Ni–Si–Cr alloy
Wang, Huei-Sen, Chen, Hou-Guang, Gu, Jhen-Wang, Hsu, Cheng-En, Wu, Chung-Yung
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.12.2014)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.12.2014)
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Journal Article
Improvement in strength and thermal conductivity of powder metallurgy produced Cu–Ni–Si–Cr alloy by adjusting Ni/Si weight ratio and hot forging
Wang, Huei-Sen, Chen, Hou-Guang, Gu, Jhen-Wang, Hsu, Cheng-En, Wu, Chung-Yung
Published in Journal of alloys and compounds (05.06.2015)
Published in Journal of alloys and compounds (05.06.2015)
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Journal Article
Microstructure evolution of the laser spot welded Ni-free Zr-based bulk metallic glass composites
Wang, Huei-Sen, Chiou, Mau-Sheng, Chen, Hou-Guang, Jang, Jason Shian-Ching, Gu, Jhen-Wang
Published in Intermetallics (01.10.2012)
Published in Intermetallics (01.10.2012)
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Journal Article
Copper-nickel-silicon-chromium quench substrate and method of producing the same
HSU, CHENG-EN, WANG, HUEI-SEN, GU, JHEN-WANG, WU, CHUNG-YUNG, CHENG, HOU-GUANG
Year of Publication 16.02.2017
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Year of Publication 16.02.2017
Patent
Copper alloy and fabrication method thereof
HSU, CHENG-EN, WANG, HUEI-SEN, GU, JHEN-WANG, WU, CHUNG-YUNG, CHENG, HOU-GUANG
Year of Publication 01.12.2015
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Year of Publication 01.12.2015
Patent