The crucial role of external force in the estimation of the topology freezing transition temperature of vitrimers by elongational creep measurements
Kaiser, Simon, Novak, Patrick, Giebler, Michael, Gschwandl, Mario, Novak, Philipp, Pilz, Gerald, Morak, Matthias, Schlögl, Sandra
Published in Polymer (Guilford) (09.09.2020)
Published in Polymer (Guilford) (09.09.2020)
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Journal Article
Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements
Morak, Matthias, Marx, Philipp, Gschwandl, Mario, Fuchs, Peter Filipp, Pfost, Martin, Wiesbrock, Frank
Published in Polymers (11.10.2018)
Published in Polymers (11.10.2018)
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Journal Article
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika
Published in Microelectronics and reliability (01.12.2022)
Published in Microelectronics and reliability (01.12.2022)
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Journal Article
Solvent Diffusion Modeling in Silicone
Wagner, Stefan, Nagl, Roland, Weissensteiner, Alexander, Strunčnik, Julija, Schönbacher, Lara, Gschwandl, Mario, Fischlschweiger, Michael, Zeiner, Tim
Published in Journal of chemical and engineering data (08.02.2024)
Published in Journal of chemical and engineering data (08.02.2024)
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Journal Article
Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
Gschwandl, Mario, Friedrich, Birgit, Pfost, Martin, Antretter, Thomas, Fuchs, Peter Filipp, Mitev, Ivaylo, Tao, Qi, Schingale, Angelika
Published in Microelectronics and reliability (01.06.2022)
Published in Microelectronics and reliability (01.06.2022)
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Journal Article
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
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Conference Proceeding
Characterization and modeling of a typical curing material for photoresist films
Peng, Chongnan, Morak, Matthias, Thalhamer, Andreas, Gschwandl, Mario, Fuchs, Peter, Tao, Qi, Krivec, Thomas, Antretter, Thomas, Celigueta, Miguel Angel
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, Mario, Pfost, Martin, Antretter, Thomas, Fuchs, Peter Filipp, Mitev, Ivaylo, Tao, Qi, Schingale, Angelika
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19.04.2021)
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Conference Proceeding
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, Mario, Frewein, Markus, Fuchs, Peter Filipp, Antretter, Thomas, Pinter, Gerald, Novak, Philipp
Published in 2018 20th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2018)
Published in 2018 20th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2018)
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Conference Proceeding
Finite element analysis of arbitrarily complex electronic devices
Gschwandl, Mario, Fuchs, Peter, Fellner, Klaus, Antretter, Thomas, Krivec, Thomas, Tao Qi
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, Mario, Fuchs, Peter Filipp, Antretter, Thomas, Pfost, Martin, Mitev, Ivaylo, Qi, Tao, Krivec, Thomas, Schingale, Angelika, Decker, Michael
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads
Yalagach, Mahesh, Filipp Fuchs, Peter, Wolfberger, Archim, Gschwandl, Mario, Antretter, Thomas, Feuchter, Michael, Tak, Coen, Tao, Qi
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations
Gschwandl, Mario, Fuchs, Peter Filipp, Mitev, Ivaylo, Yalagach, Mahesh, Antretter, Thomas, Tao Qi, Schingale, Angelika
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding