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Year of Publication 16.03.1999
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Microcavity structure and process
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Year of Publication 01.08.2010
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Method for forming a solder mold with venting channels and method for using the same
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Year of Publication 11.02.2009
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Year of Publication 11.02.2009
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Microcavity structure and process
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Year of Publication 26.05.2010
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Year of Publication 26.05.2010
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Etched glass solder bump transfer for flip chip integrated circuit devices
ROUX; STEPHEN, SPEIDELL; JAMES LOUIS, CORDES; STEVEN A, GRUBER; PETER ALFRED, SAMBUCETTI; CARLOS JUAN, KUMMER; EGON MAX
Year of Publication 22.08.2000
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Year of Publication 22.08.2000
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Electrical interconnect structure and method of forming the same
NAH JAE-WOONG, GRUBER PETER ALFRED, FURMAN BRUCE KENNETH, SHIH DA-YUAN, BUCHWALTER STEPHEN LESLIE
Year of Publication 17.02.2010
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Year of Publication 17.02.2010
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Method for building interconnect structures by injection molded solder and structures built
ROUX; STEPHEN, SPEIDELL; JAMES LOUIS, PATEL; RAJESH SHANKERLAL, GRUBER; PETER ALFRED, BERGER; DANIEL GEORGE, DANOVITCH; DAVID HIRSCH, SAMBUCETTI; CARLOS JUAN, BROUILLETTE; GUY PAUL
Year of Publication 21.11.2000
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Year of Publication 21.11.2000
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Method for building interconnect structures by injection molded solder and structures built
ROUX; STEPHEN, SPEIDELL; JAMES LOUIS, PATEL; RAJESH SHANKERLAL, GRUBER; PETER ALFRED, BERGER; DANIEL GEORGE, DANOVITCH; DAVID HIRSCH, SAMBUCETTI; CARLOS JUAN, BROUILLETTE; GUY PAUL
Year of Publication 17.10.2000
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Year of Publication 17.10.2000
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EP0565908
HERNANDEZ, BERNARDO, PALMER, MICHAEL JOHN, GRUBER, PETER ALFRED, ZINGHER, ARTHUR RICHARD, FERENCE, THOMAS GEORGE
Year of Publication 16.02.1994
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Year of Publication 16.02.1994
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Method for building interconnect structures by injection molded solder and structures built
ROUX; STEPHEN, SPEIDELL; JAMES LOUIS, PATEL; RAJESH SHANKERLAL, GRUBER; PETER ALFRED, BERGER; DANIEL GEORGE, DANOVITCH; DAVID HIRSCH, SAMBUCETTI; CARLOS JUAN, BROUILLETTE; GUY PAUL
Year of Publication 07.07.1998
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Year of Publication 07.07.1998
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METHOD OF ATTACHMENT OF A HEAT-CONDUCTIVE ELEMENT TO AN ELECTRIC CIRCUIT CHIP
FLINT, EPHRAIM BEMIS, OLIVE, GRAHAM, MARKS, RONALD FRANKLIN, GRUBER, PETER ALFRED, ZINGHER, ARTHUR RICHARD
Year of Publication 13.12.1989
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Year of Publication 13.12.1989
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Method of attachment of a heat-conductive element to an electric circuit chip
FLINT, EPHRAIM BEMIS, OLIVE, GRAHAM, MARKS, RONALD FRANKLIN, GRUBER, PETER ALFRED, ZINGHER, ARTHUR RICHARD
Year of Publication 11.11.1987
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Year of Publication 11.11.1987
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