Enabling Low-Temperature Bonding in Advanced Packaging Using Electrodeposited Indium
Yi Qin, Flajslik, Kristen, Sherzer, Brandon, Banelis, Emily, Inho Lee, Cho, Regina, Grippo, Louis, Imanari, Masaaki, Lefebvre, Mark, Lingyun Wei, Tachikawa, Wataru, Jianwei Dong, Calvert, Jeffrey
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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