Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Crack and damage evaluation in low-k BEoL structures under CPI aspects
Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding