by Chumakov, D., Lindert, F., Lehr, M.U., Grillberger, M., Zschech, E.
Published in IEEE transactions on semiconductor manufacturing (01.11.2009)

by Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)

by Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)

by Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)