Ultra-Dense: an MCM-based 3-D digital signal processor
Segelken, J.M., Wu, L.J., Lau, M.Y., Tai, K.L., Shively, R.R., Grau, T.G.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.08.1992)
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