Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology
Wei-Tsu Tseng, Devarapalli, Vamsi, Steffes, James, Ticknor, Adam, Khojasteh, Mahmoud, Poloju, Praneetha, Goyette, Colin, Steber, David, Tai, Leo, Molis, Steven, Zaitz, Mary, Rill, Elliott, Kennett, Michael, Economikos, Laertis, Lustig, Naftali, Bunke, Christine, Truong, Connie, Chudzik, Michael, Grunow, Stephan
Published in IEEE transactions on semiconductor manufacturing (01.11.2013)
Published in IEEE transactions on semiconductor manufacturing (01.11.2013)
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Journal Article
Conference Proceeding
Hybrid clean approach for post-copper CMP defect reduction
Wei-Tsu Tseng, Devarapalli, Vamsi, Steffes, James, Ticknor, Adam, Khojasteh, Mahmoud, Poloju, Praneetha, Goyette, Colin, Steber, David, Leo Tai, Molis, Steven, Zaitz, Mary, Rill, Elliott, Mittal, Surbhi, Kennett, Michael, Economikos, Laertis, Ouimet, George, Bunke, Christine, Truong, Connie, Grunow, Stephan, Chudzik, Michael
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
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Conference Proceeding
Post metal chemical-mechanical planarization cleaning process
KENNETT MICHAEL R, TICKNOR ADAM D, DEVARAPALLI VAMSI, TSENG WEI-TSU, GOYETTE COLIN J, KHOJASTEH MAHMOUD, LIN QINGHUANG, STEFFES JAMES J
Year of Publication 30.12.2014
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Year of Publication 30.12.2014
Patent
POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS
KENNETT MICHAEL R, TICKNOR ADAM D, DEVARAPALLI VAMSI, TSENG WEI-TSU, GOYETTE COLIN J, KHOJASTEH MAHMOUD, LIN QINGHUANG, STEFFES JAMES J
Year of Publication 11.09.2014
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Year of Publication 11.09.2014
Patent