Acoustic detection of micro-cracks in small electronic devices
Get full text
Journal Article
Conference Proceeding
Degradation of moulding compounds during highly accelerated stress tests – A simple approach to study adhesion by performing button shear tests
Pufall, R., Goroll, M., Mahler, J., Kanert, W., Bouazza, M., Wittler, O., Dudek, R.
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
Get full text
Journal Article
Conference Proceeding
Exceptional operative gate voltage induces negative bias temperature instability (NBTI) on n-type trench DMOS transistors
Aresu, S., Kanert, W., Pufall, R., Goroll, M.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
Get full text
Journal Article
Conference Proceeding
Reduction of test effort. Looking for more acceleration for reliable components for automotive applications
Pufall, R., Kanert, W., Aresu, S., Goroll, M.
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
Get full text
Journal Article
Conference Proceeding
ESD protection structure qualification – a new approach for release for automotive applications
Get full text
Journal Article
Conference Proceeding
Time-Dependent Behaviour of Bonded Silicon Dies under Subcritical, Constant Shear Loading
Pflugler, N., Pufall, R., Goroll, M., Breitenreiner, S., Wunderle, B.
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01.09.2019)
Get full text
Conference Proceeding
Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation
Pufall, R., Goroll, M., Reuther, G. M.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Get full text
Conference Proceeding
Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R, Goroll, M, Mahler, J, Kanert, W, Bouazza, M, Wittler, O, Dudek, R
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Get full text
Conference Proceeding
Adhesion of moulding compounds on various surfaces. A study on moisture influence and degradation after high temperature storage
Pufall, R, Goroll, M, Bouazza, M, Wittler, O, Michel, B
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Get full text
Conference Proceeding
A differential measurement SAW device for passive remote sensoring
Buff, W., Rusko, M., Vandahl, T., Goroll, M., Moller, F.
Published in 1996 IEEE Ultrasonics Symposium. Proceedings (1996)
Published in 1996 IEEE Ultrasonics Symposium. Proceedings (1996)
Get full text
Conference Proceeding
Semiconductors in high temperature applications – a future trend in automotive industry
GOROLL, Michael, PUFALL, Reinhard, KANERT, Werner, PLIKAT, Boris
Published in Microelectronics and reliability (01.09.2004)
Published in Microelectronics and reliability (01.09.2004)
Get full text
Journal Article
Conference Proceeding
On-chip correlation-a new approach to narrow band SAW identification tags
Buff, W., Ehrenpfordt, J., Klett, S., Rusko, M., Goroll, M.
Published in 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102) (1998)
Published in 1998 IEEE Ultrasonics Symposium. Proceedings (Cat. No. 98CH36102) (1998)
Get full text
Conference Proceeding
Understanding delamination for fast development of reliable packages for automotive applications. A consideration of adhesion by interlocking and anchoring
Pufall, R., Goroll, M., Reuther, G. M.
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Get full text
Conference Proceeding
Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation
Pufall, R., Goroll, M., Kanert, W., Dudek, R.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Get full text
Conference Proceeding
Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
Maus, I., Pape, H., Nabi, H. S., Goroll, M., Preu, H., Keller, J., Ernst, L. J., Michel, B., Wunderle, B.
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Get full text
Conference Proceeding
From the ESD robustness of products to the system ESD robustness
Stadler, W., Bargstadt-Franke, S., Brodbeck, T., Gaertner, R., Goroll, M., Gosner, H., Jensen, Chr. Muller N.
Published in 2004 Electrical Overstress/Electrostatic Discharge Symposium (01.09.2004)
Published in 2004 Electrical Overstress/Electrostatic Discharge Symposium (01.09.2004)
Get full text
Conference Proceeding