METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
GOPINATH SANJAY, ERMEZ SEMA, NEO SIEW, COLLINS JOSHUA, BAMNOLKER HANNA, DANEK MICHAL, JANDL ADAM, SCHLOSS LAWRENCE
Year of Publication 04.07.2023
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Year of Publication 04.07.2023
Patent
유전체 표면들 상의 몰리브덴에 비-금속 혼입
LEE SANG HYEOB, VAN CLEEMPUT PATRICK, GOPINATH SANJAY, COLLINS JOSHUA, BAMNOLKER HANNA, KENNEDY GRIFFIN JOHN, SCHLOSS LAWRENCE
Year of Publication 25.10.2023
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Year of Publication 25.10.2023
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Catalytic acetalization of carbonyl compounds over cation (Ce3+, Fe3+ and Al3+) exchanged montmorillonites and Ce3+-exchanged Y zeolites
Thomas, Bejoy, Ramu, Vasanthakumar Ganga, Gopinath, Sanjay, George, Jino, Kurian, Manju, Laurent, Guillaume, Drisko, Glenna L., Sugunan, Sankaran
Published in Applied clay science (01.08.2011)
Published in Applied clay science (01.08.2011)
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핵생성-프리 텅스텐 증착
GOPINATH SANJAY, ERMEZ SEMA, DENG RUOPENG, NISHIOKA YUTAKA, BA XIAOLAN, DANEK MICHAL
Year of Publication 30.12.2021
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Year of Publication 30.12.2021
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텅스텐 증착
GOPINATH SANJAY, NANNAPANENI PRAGNA, ERMEZ SEMA, DENG RUOPENG, TJOKRO NOVY, BA XIAOLAN, YU TIANHUA
Year of Publication 15.04.2022
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Year of Publication 15.04.2022
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다층 피처 충진
GOPINATH SANJAY, DENG RUOPENG, GAO JUWEN, BA XIAOLAN, SCHLOSS LAWRENCE
Year of Publication 11.03.2021
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Year of Publication 11.03.2021
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반도체-제작 프로세스들을 위한 성능 예측기들
GOPINATH SANJAY, ROHAM SASSAN, BROGAN LEE J, SRIRAMAN SARAVANAPRIYAN, HASKELL BENJAMIN ALLEN, COHEN DAVID G, DANEK MICHAL, VELLANKI RAVI, SAWLANI KAPIL UMESH
Year of Publication 04.10.2022
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Year of Publication 04.10.2022
Patent
금속 증착
GOPINATH SANJAY, CHEN YEN CHANG, BUTAIL GORUN, MAJUMDER PRODYUT, TJOKRO NOVY, THOMBARE SHRUTI VIVEK, VAN CLEEMPUT PATRICK A, LENZ ERIC H, DANEK MICHAL, VELLANKI RAVI, GULABAL VINAYAKARADDY
Year of Publication 28.04.2022
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Year of Publication 28.04.2022
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3차원 수직 NAND 워드라인을 위한 금속 충진 프로세스
GOPINATH SANJAY, HUMAYUN RAASHINA, ASHTIANI KAIHAN ABIDI, GAO JUWEN, DANEK MICHAL, SCHLOSS LAWRENCE
Year of Publication 26.03.2020
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Year of Publication 26.03.2020
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Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter
Li, Yunlong, Van Huylenbroeck, Stefaan, Roussel, Philippe, Brouri, Mohand, Gopinath, Sanjay, Anjos, Daniela M., Thorum, Matthew, Yu, Jengyi, Beyer, Gerald P., Beyne, Eric, Croes, Kristof
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Journal Article
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
GOPINATH SANJAY, ERMEZ SEMA, NEO SIEW, COLLINS JOSHUA, BAMNOLKER HANNA, DANEK MICHAL, JANDL ADAM, SCHLOSS LAWRENCE
Year of Publication 26.02.2018
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Year of Publication 26.02.2018
Patent