HCI Improvement on 14nm FinFET IO Device by Optimization of 3D Junction Profile
Wan, Xinggon, Zhu, Baofu, Mohan, Meera, Wu, Keija, Choi, Dongil, Gondal, Arfa
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
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Conference Proceeding
Impact of electrode surface modulation on time-dependent dielectric breakdown
Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer
Premachandran, C. S., Ranjan, Rakesh, Agarwal, Rahul, Yap Sing Fui, Paliwoda, Peter, Sarasvathi, Thangaraju, Arfa, Gondal, Patrick, Justison, Mahadeva Iyer, Natarajan
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding