Introduction of Reverse Pyramid Configuration with Package Construction Characterization for Die Tilt Resolution of Highly Sensitive Multi-Stacked Dice Sensor Device
Sumagpang, Antonio R., Gomez, Frederick Ray I., Rodriguez, Rennier S.
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Enhanced Loop Height Optimization for Complex Configuration on QFN Device
Moreno, Anthony R., Gomez, Frederick Ray I., Graycochea, Edwin M.
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation
Buenviaje, Salvador C., Rodriguez, Rennier S., Seguido, Rammil A., Gomez, Frederick Ray I.
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
A Study of Wafer Backgrinding Tape Selection for SOI Wafers
Bacquian, Bryan Christian S., Gomez, Frederick Ray I.
Published in Journal of Engineering Research and Reports (11.07.2019)
Published in Journal of Engineering Research and Reports (11.07.2019)
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Journal Article
Wirebond Stability Resolution on Automotive MEMS Device Through Tape Adhesion Thickness and Plasma Characterization
Bamba, Behra E., Gomez, Frederick Ray I., Rillera, Jane Wanzel E.
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Specialized Lead Design of Leadframe Packages for Improved Mold Adhesion
Gomez, Frederick Ray, Rodriguez, Rennier
Published in Journal of Engineering Research and Reports (10.07.2020)
Published in Journal of Engineering Research and Reports (10.07.2020)
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Journal Article
Semiconductor QFN Package with Advanced Interlocking Design
Rodriguez, Rennier, Gomez, Frederick Ray
Published in Journal of Engineering Research and Reports (06.04.2020)
Published in Journal of Engineering Research and Reports (06.04.2020)
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Journal Article
Die Attach Process Robustness through Epoxy Pattern Optimization for DFN Device
Dinglasan, Jerome J., Gomez, Frederick Ray I.
Published in Journal of Engineering Research and Reports (21.04.2021)
Published in Journal of Engineering Research and Reports (21.04.2021)
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Journal Article
Addressing Delamination through Advanced Semiconductor Die Design
Rodriguez, Rennier S., Gomez, Frederick Ray I.
Published in Journal of Engineering Research and Reports (31.03.2021)
Published in Journal of Engineering Research and Reports (31.03.2021)
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Journal Article
Enhanced Wirebonding Technique on QFN Device with Critical Die Reference
Pulido, Jonathan C., Gomez, Frederick Ray I.
Published in Journal of Engineering Research and Reports (11.03.2021)
Published in Journal of Engineering Research and Reports (11.03.2021)
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Journal Article
Bond Pad Probe Marks Effect on Intermetallic Coverage
Moreno, Anthony, Rodriguez, Rennier, Gomez, Frederick Ray
Published in Journal of Engineering Research and Reports (29.01.2021)
Published in Journal of Engineering Research and Reports (29.01.2021)
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Journal Article
Specialized EMI Shielding Process for Semiconductor Package
Rodriguez, Rennier S., Gomez, Frederick Ray I.
Published in Journal of Engineering Research and Reports (19.12.2020)
Published in Journal of Engineering Research and Reports (19.12.2020)
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Journal Article
Integration of EMI Shielding Design for Substrate Package Isolation
Gomez, Frederick Ray I., Rodriguez, Rennier S.
Published in Journal of Engineering Research and Reports (06.10.2020)
Published in Journal of Engineering Research and Reports (06.10.2020)
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Journal Article
Resolution of Damaged Metallization on Highly Complex Semiconductor Device
Sumagpang Jr, Antonio, Gomez, Frederick Ray
Published in Journal of Engineering Research and Reports (31.08.2020)
Published in Journal of Engineering Research and Reports (31.08.2020)
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Journal Article
Metallized Semiconductor Die for Long Wire Interconnect
Gomez, Frederick Ray I., Rodriguez, Rennier S.
Published in Journal of Engineering Research and Reports (24.07.2020)
Published in Journal of Engineering Research and Reports (24.07.2020)
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Journal Article
Effect of Backgrinding Tape Lamination on Die Alignment
Bacquian, Bryan Christian, Gomez, Frederick Ray
Published in Journal of Engineering Research and Reports (21.07.2020)
Published in Journal of Engineering Research and Reports (21.07.2020)
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Journal Article