Conditions for Mode I crack deviation in orthotropic plane subjected to biaxial loading
Goldstein, R.V., Shifrin, E.I.
Published in International journal of engineering science (01.12.2012)
Published in International journal of engineering science (01.12.2012)
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Journal Article
Effect of Partial Closure of an Interface Crack with Heat-conducting Filler and Surface Films in the Case of Thermal Loading of a Bimaterial
Goldstein, R. V., Kit, H. S., Martynyak, R. M., Serednytska, Kh. I.
Published in Journal of mathematical sciences (New York, N.Y.) (01.04.2014)
Published in Journal of mathematical sciences (New York, N.Y.) (01.04.2014)
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Journal Article
On the peculiarities of a crack growth path in anisotropic solid
Goldstein, R.V., Shifrin, E.I.
Published in Proceedings in applied mathematics and mechanics (01.12.2007)
Published in Proceedings in applied mathematics and mechanics (01.12.2007)
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Journal Article
Experimental and theoretical investigation of formation of the oxygen-containing precipitate-dislocation loop system in silicon
Goldstein, R. V., Mezhennyi, M. V., Mil’vidskii, M. G., Reznik, V. Ya, Ustinov, K. B., Shushpannikov, P. S.
Published in Physics of the solid state (01.03.2011)
Published in Physics of the solid state (01.03.2011)
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Journal Article
Modeling of failure and lifetime of thin-film metal conductors in integrated circuits
Valiev, K.A., Goldstein, R.V., Zhitnikov, Yu.V., Makhviladze, T.M., Sarychev, M.E.
Published in Physical mesomechanics (01.05.2008)
Published in Physical mesomechanics (01.05.2008)
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Journal Article