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"Goh Wei Chuan"
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"Goh Wei Chuan"
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Air cavity package using high temperature silicone adhesive
by
Lee, Chee Kong
,
Goh
,
Wei Chuan
,
Koba, Richard J
,
Chin, Sin Yee
Year of Publication
18.01.2022
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Copper flanged air cavity packages for high frequency devices
by
Lee, Chee Kong
,
Goh
,
Wei Chuan
,
Koba, Richard J
,
Chin, Sin Yee
Year of Publication
25.12.2018
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AIR CAVITY PACKAGE
by
NG, Joelle
,
LEE, Chee Kong
,
GOH
,
Wei Chuan
,
KOBA, Richard J
Year of Publication
18.04.2018
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COPPER FLANGED AIR CAVITY PACKAGES FOR HIGH FREQUENCY DEVICES
by
Chin Sin Yee
,
Koba Richard J
,
Lee Chee Kong
,
Goh Wei Chuan
Year of Publication
23.11.2017
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COPPER FLANGED AIR CAVITY PACKAGES FOR HIGH FREQUENCY DEVICES
by
CHIN, Sin Yee
,
LEE, Chee Kong
,
GOH
,
Wei Chuan
,
KOBA, Richard J
Year of Publication
23.11.2017
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AIR CAVITY PACKAGE
by
CHIN, Sin Yee
,
LEE, Chee Kong
,
GOH
,
Wei Chuan
,
KOBA, Richard J
Year of Publication
16.11.2017
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AIR CAVITY PACKAGE
by
Chin Sin Yee
,
Koba Richard J
,
Lee Chee Kong
,
Goh Wei Chuan
Year of Publication
09.11.2017
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AIR CAVITY PACKAGE
by
NG, Joelle
,
LEE, Chee Kong
,
GOH
,
Wei Chuan
,
KOBA, Richard J
Year of Publication
29.03.2017
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AIR CAVITY PACKAGE
by
Koba Richard J
,
Lee Chee Kong
,
Ng Joelle
,
Goh Wei Chuan
Year of Publication
09.03.2017
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AIR CAVITY PACKAGE
by
NG, Joelle
,
LEE, Chee Kong
,
GOH
,
Wei Chuan
,
KOBA, Richard J
Year of Publication
30.01.2017
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AIR CAVITY PACKAGE
by
GOH
,
WEI CHUAN
,
KOBA, RICHARD J
,
LEE, CHEE KONG
,
NG, JOELLE
Year of Publication
29.12.2016
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AIR CAVITY PACKAGE
by
GOH
,
WEI CHUAN
,
KOBA, RICHARD J
,
LEE, CHEE KONG
,
NG, JOELLE
Year of Publication
26.11.2015
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Air cavity package
by
GOH WEI CHUAN
,
KOBA RICHARD J
,
NG JOELLE
,
LEE CHEE KONG
Year of Publication
22.03.2017
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Structure and method for message snooping in SCSI bus expanders
by
Young, B. Arlen
,
Packer, John S
,
Goh
,
Wei Chuan
Year of Publication
12.10.2004
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Structure and method for message snooping in SCSI bus expanders
by
GOH WEI CHUAN
,
YOUNG B. ARLEN
,
PACKER JOHN S
Year of Publication
12.10.2004
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