A comprehensive study on BGA block warpage and prediction methodology
Duca, Roseanne, En Luan, Jing, Hla, Phone Maw, Kim-Yong Goh
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Simulation driven physics-of-failure analysis for System-in-Package development
Xueren Zhang, Kim-Yong Goh, Laurent, Patrick, Formosa, Kevin, Teysseyre, Jerome
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Challenges for extra large embedded wafer level ball grid array development
Jing-en Luan, Yonggang Jin, Kim-yong Goh, Yiyi Ma, Guojun Hu, Yaohuang Huang, Baraton, X.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
A novel methodology for virtual qualification of IC packages under board level drop test
Luan Jing-en, Kim-yong Goh, Baraton, X.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Design for Improvement of Drop Impact Performance of IC Packages
Jing-en Luan, Kim-yong Goh
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Camera Module Design, Assembly and Test Challenges
Jing-en Luan, Baraton, X., Wingshenq Wong, Kim-yong Goh, Yap, D.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Board level drop test simulation using explicit and implicit solvers
Yiyi Ma, Kim-Yong Goh, Xueren Zhang
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Enhance TCOB life for wafer level package with a new leadfree solder alloy
Xueren Zhang, Wei Zhen Goh, Kim-sing Wong, Yap, Daniel, Kim-yong Goh
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Wirebondability enhancement for very small die in power packages with dynamic simulation
Xueren Zhang, Kim-yong Goh, Yiyi Ma, Verano, Tito, Fundan, Raquel, Wingshenq Wong, Renard, Loic
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Copper wirebond pull test and reliability characterization with finite element simulation
Xueren Zhang, Teysseyre, J., Kim-Yong Goh, Wingshenq Wong
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages
Bentata, Y., Forster, S., Kim Yong Goh, Fremont, H.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Thermoelastic properties of printed circuit boards: Effect of copper trace
Hu Guojun, Goh Kim Yong, Luan Jing-en, Lim Wee Chin, Baraton, X.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding
Drop impact life model development for FBGA assembly with lead-free solder joint
Faxing Che, Jing-En Luan, Kim Yong Goh, Baraton, X.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder
Fa-Xing Che, Jing-En Luan, Yap, Daniel, Kim-Yong Goh, Baraton, Xavier
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods
Fa Xing Che, Yap, D., Jing En Luan, Kim Yong Goh, Yi Yi Ma
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA
Hun Shen Ng, Tong Yan Tee, Kim Yong Goh, Jing-en Luan, Reinikainen, T., Hussa, E., Kujala, A.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding