Molecular Epidemiology of Multidrug-Resistant Acinetobacter baumannii in a Single Institution over a 10-Year Period
Runnegar, Naomi, Sidjabat, Hanna, Goh, H.M. Sharon, Nimmo, Graeme R, Schembri, Mark A, Paterson, David L
Published in Journal of Clinical Microbiology (01.11.2010)
Published in Journal of Clinical Microbiology (01.11.2010)
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Journal Article
Study of factors affecting the hardness of ball bonds in copper wire bonding
Zhong, Z.W., Ho, H.M., Tan, Y.C., Tan, W.C., Goh, H.M., Toh, B.H., Tan, J.
Published in Microelectronic engineering (01.02.2007)
Published in Microelectronic engineering (01.02.2007)
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Journal Article
Anhydrous polymer‐based coating with sustainable controlled release functionality for facile, efficacious impregnation, and delivery of antimicrobial peptides
Lim, Kaiyang, Saravanan, Rathi, Chong, Kelvin K. L., Goh, Sharon H. M., Chua, Ray R. Y., Tambyah, Paul A., Chang, Matthew W., Kline, Kimberly A., Leong, Susanna S. J.
Published in Biotechnology and bioengineering (01.08.2018)
Published in Biotechnology and bioengineering (01.08.2018)
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Journal Article
Bladder catheterization increases susceptibility to infection that can be prevented by prophylactic antibiotic treatment
Rousseau, Matthieu, Goh, H M Sharon, Holec, Sarah, Albert, Matthew L, Williams, Rohan Bh, Ingersoll, Molly A, Kline, Kimberly A
Published in JCI insight (22.09.2016)
Published in JCI insight (22.09.2016)
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Journal Article
Strain rate sensitivity and Hall–Petch behavior of ultrafine-grained gold wires
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Journal Article
Conference Proceeding
Molecular ecology of a facultative swine waste lagoon
Goh, S.H.M, Mabbett, A.N, Welch, J.P, Hall, S.J, McEwan, A.G
Published in Letters in applied microbiology (01.04.2009)
Published in Letters in applied microbiology (01.04.2009)
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Journal Article
A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels
Stephan, D., Chew, Y.H., Goh, H.M., Pasamanero, E., Theint, E.P.P., Calpito, D.R.M., Ling, J.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
High temperature storage (HTS) performance of copper ball bonding wires
Saraswati, Ei Phyu Phyu Theint, Stephan, D., Goh, H.M., Pasamanero, E., Calpito, D.R.M., Wulff, F.W., Breach, C.D.
Published in 2005 7th Electronic Packaging Technology Conference (2005)
Published in 2005 7th Electronic Packaging Technology Conference (2005)
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Conference Proceeding