Ambient Fabrication of Large-Area Graphene Films via a Synchronous Reduction and Assembly Strategy
Cao, Xuebo, Qi, Dianpeng, Yin, Shengyan, Bu, Jing, Li, Fengji, Goh, Chin Foo, Zhang, Sam, Chen, Xiaodong
Published in Advanced materials (Weinheim) (04.06.2013)
Published in Advanced materials (Weinheim) (04.06.2013)
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Journal Article
Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages
Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Kristine Ong, Chin Foo Goh, Lay Kuan Teh
Published in IEEE transactions on components and packaging technologies (01.03.2005)
Published in IEEE transactions on components and packaging technologies (01.03.2005)
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Journal Article
Patterning Colloidal Metal Nanoparticles for Controlled Growth of Carbon Nanotubes
Li, Bing, Goh, Chin Foo, Zhou, Xiaozhu, Lu, Gang, Tantang, Hosea, Chen, Yanhong, Xue, Can, Boey, Freddy Y. C., Zhang, Hua
Published in Advanced materials (Weinheim) (17.12.2008)
Published in Advanced materials (Weinheim) (17.12.2008)
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Journal Article
Facile “Needle‐Scratching” Method for Fast Catalyst Patterns Used for Large‐Scale Growth of Densely Aligned Single‐Walled Carbon‐Nanotube Arrays
Li, Bing, Cao, Xiehong, Huang, Xiao, Lu, Gang, Huang, Yizhong, Goh, Chin Foo, Boey, Freddy Y. C., Zhang, Hua
Published in Small (Weinheim an der Bergstrasse, Germany) (18.09.2009)
Published in Small (Weinheim an der Bergstrasse, Germany) (18.09.2009)
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Journal Article
Protein-Based Memristive Nanodevices
Meng, Fanben, Jiang, Lin, Zheng, Kaihong, Goh, Chin Foo, Lim, Sierin, Hng, Huey Hoon, Ma, Jan, Boey, Freddy, Chen, Xiaodong
Published in Small (Weinheim an der Bergstrasse, Germany) (04.11.2011)
Published in Small (Weinheim an der Bergstrasse, Germany) (04.11.2011)
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Journal Article
Molecular Nanodevices: Protein-Based Memristive Nanodevices (Small 21/2011)
Meng, Fanben, Jiang, Lin, Zheng, Kaihong, Goh, Chin Foo, Lim, Sierin, Hng, Huey Hoon, Ma, Jan, Boey, Freddy, Chen, Xiaodong
Published in Small (Weinheim an der Bergstrasse, Germany) (04.11.2011)
Published in Small (Weinheim an der Bergstrasse, Germany) (04.11.2011)
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Journal Article
Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]
Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Ong, K., Chin Foo Goh
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
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Conference Proceeding
AN OCULAR SURGICAL DEVICE
GOH, CHIN FOO, BOEY, YIN CHIANG FREDDY, SINGH MEHTA, JODHBIR, TAN, TIANG HWEE DONALD
Year of Publication 14.05.2015
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Year of Publication 14.05.2015
Patent