Search Results - "Givry, Jacques de" :: K.UTB vyhledávací portál

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Versailles, la Grande Perspective

by Givry, Jacques de, Périlon, Yves
Published in Versalia : revue de la Société des amis de Versailles (01.01.2008)

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Journal Article

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Verfahren zum Anschließen der Ausgangsbereiche eines Chips mit integrierter Schaltung und so erhaltener Mehr-Chip-Modul

by GIVRY, JACQUES DE, LES LOGES EN JOSAS, FR
Year of Publication 23.11.1995

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Patent

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BOITIER A MICROCIRCUIT INTEGRE ET PROCEDE DE MONTAGE DE MICROCIRCUIT INTEGRE

by DE GIVRY JACQUES
Year of Publication 13.07.2000

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Patent

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Substrate interconnection mechanism

by DE GIVRY JACQUES
Year of Publication 26.03.1999

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Patent

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Multiple layer casing for high frequency microelectronic circuit

by DE GIVRY JACQUES
Year of Publication 31.07.1998

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Patent

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Method of connecting the output pads on an integrated circuit chip,and multichip module thus obtained

by JACQUES DE GIVRY
Year of Publication 01.04.1998

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Patent

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Zwischenstück für mikroelektronisches Gehäuse und Verfahren zur Herstellung eines solchen Zwischenstücks

by DE GIVRY, JACQUES
Year of Publication 15.01.2009

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Patent

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A method for connecting electronic circuits in a multi-chip module having a co-fired substrate, and multi-chip module obtained thereby

by JACQUES DE GIVRY
Year of Publication 15.10.1997

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Patent

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Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained

by DE GIVRY; JACQUES
Year of Publication 18.03.1997

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Patent

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Method for connecting electronic circuits in a multi-chip module having a co-fired substrate and multi-chip module obtained thereby

by DE GIVRY; JACQUES
Year of Publication 08.10.1996

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Patent

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PIEZA PARA INTERCALAR PARA CAJA MICROELECTRONICA Y PROCEDIMIENTO DE FABRICACION DE DICHA PIEZA PARA INTERCALAR

by DE GIVRY, JACQUES
Year of Publication 16.06.2008

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Patent

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Procédé de raccordement des plages de sortie d'une puce à circuit intégré, et module multipuces ainsi obtenu

by DE GIVRY JACQUES
Year of Publication 02.08.1996

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Patent

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Procédé pour connecter des circuits électoniques dans un module multi-puces à substrat co-cuit, et module multi-puces ainsi obtenu

by DE GIVRY JACQUES
Year of Publication 07.06.1996

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Patent

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Connecting the output pads on an i.c. chip, using an adaptor board

by JACQUES DE GIVRY
Year of Publication 06.12.1995

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Patent

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Semiconductor memory component comprising stacked memory modules

by DE GIVRY; JACQUES
Year of Publication 05.12.1995

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Patent

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Connecting electronic circuits in a multi-chip module having a co-fired substrate

by JACQUES DE GIVRY
Year of Publication 06.09.1995

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Patent

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Intermediate part for a microelectronic package and method of manufacturing such an intermediate part

by DE GIVRY, JACQUES
Year of Publication 16.01.2008

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Patent

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Integrated microcircuit flip-chip assembly grouped in layered multi-chip modules

by DE GIVRY JACQUES
Year of Publication 04.08.1995

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Patent

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Solid state memory modules and memory devices including such modules

by DE GIVRY; JACQUES
Year of Publication 20.07.1993

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Patent

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Modular micro-electronic circuit base - has components on substrates with regularly spaced flexible contacts inserted into racks cooperating with flat contacts on chassis

by JACQUES DE GIVRY
Year of Publication 06.05.1983

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Patent

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