Perfusion System for Modification of Luminal Contents of Human Intestinal Organoids and Realtime Imaging Analysis of Microbial Populations
Ginga, Nicholas J, Slyman, Raleigh, Kim, Ge-Ah, Parigoris, Eric, Huang, Sha, Yadagiri, Veda K, Young, Vincent B, Spence, Jason R, Takayama, Shuichi
Published in Micromachines (Basel) (14.01.2022)
Published in Micromachines (Basel) (14.01.2022)
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Journal Article
Super-resolution imaging of linearized chromatin in tunable nanochannels
Lee, Ji-Hoon, Chiu, Joyce Han-Ching, Ginga, Nicholas J, Ahmed, Tasdiq, Thouless, M. D, Liu, Yifan, Takayama, Shuichi
Published in Nanoscale horizons (24.07.2023)
Published in Nanoscale horizons (24.07.2023)
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Journal Article
Enhanced Interfacial Toughness of Thermoplastic–Epoxy Interfaces Using ALD Surface Treatments
Chen, Yuxin, Ginga, Nicholas J, LePage, William S, Kazyak, Eric, Gayle, Andrew J, Wang, Jing, Rodríguez, Robin E, Thouless, M. D, Dasgupta, Neil P
Published in ACS applied materials & interfaces (20.11.2019)
Published in ACS applied materials & interfaces (20.11.2019)
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Journal Article
High-force, precise, and bidirectional uniaxial stretcher for real-time imaging of normally closed h-PDMS crack-valves for femto-liter fluid delivery
Ginga, Nicholas J., Chiu, Joyce Han-Ching, Lee, Ji-Hoon, Thouless, M. D., Takayama, Shuichi
Published in Microfluidics and nanofluidics (01.04.2022)
Published in Microfluidics and nanofluidics (01.04.2022)
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Journal Article
New Method to Measure Tensile Strength of Low Modulus Thin Films
Ginga, Nicholas J., Sitaraman, Suresh K.
Published in International journal of fracture (01.08.2011)
Published in International journal of fracture (01.08.2011)
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Journal Article
Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability
Ginga, Nicholas J., Chen, Rui, Sitaraman, Suresh K.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions
Chen, Rui, Ginga, Nicholas J., Sitaraman, Suresh K.
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment
Chen, Rui, Ginga, Nicholas J., Sitaraman, Suresh K.
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Investigation of Mechanical Reliability of Flexible/Stretchable Electronic Materials Using Multi-Axial Stretch Techniques
Morgan, Nathan S., Godbole, Kaushik U., Stewart, Benjamin G., Sitaraman, Suresh K., Ginga, Nicholas J.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Biaxial Inflation Stretch Test for Printed Electronics
Stewart, Benjamin G., Ginga, Nicholas J., Sitaraman, Suresh K.
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding