Current leakage relaxation and charge trapping in ultra-porous low- k materials
Borja, Juan, Plawsky, Joel L., Lu, T.-M., Bakhru, Hassaram, Gill, William N.
Published in Journal of applied physics (28.02.2014)
Published in Journal of applied physics (28.02.2014)
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Journal Article
Charge transport model to predict intrinsic reliability for dielectric materials
Ogden, Sean P., Borja, Juan, Plawsky, Joel L., Lu, T.-M., Yeap, Kong Boon, Gill, William N.
Published in Journal of applied physics (28.09.2015)
Published in Journal of applied physics (28.09.2015)
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Journal Article
On the dynamics of Cu ions injection into low-k nanoporous materials under oscillating applied fields
Borja, Juan, Plawsky, Joel. L., Lu, T.-M., Gill, William N.
Published in Journal of applied physics (21.01.2013)
Published in Journal of applied physics (21.01.2013)
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Journal Article
Impact of Frequency From a Bipolar Applied Field on Dielectric Breakdown for Low- k Materials
Borja, J., Plawsky, J. L., Lu, T., Gill, W. N.
Published in IEEE transactions on electron devices (01.06.2012)
Published in IEEE transactions on electron devices (01.06.2012)
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Journal Article
Variable Ramp Rate Breakdown Experiments and the Role of Metal Injection in Low- k Dielectrics
Plawsky, J. L., Borja, J., Williams, B., Riley, M. J., Gill, W. N.
Published in IEEE transactions on electron devices (01.12.2011)
Published in IEEE transactions on electron devices (01.12.2011)
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Journal Article
Flux enhancement by hydrophilization of thin film composite reverse osmosis membranes
Kulkarni, Ashish, Mukherjee, Debabrata, Gill, William N.
Published in Journal of membrane science (29.05.1996)
Published in Journal of membrane science (29.05.1996)
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Journal Article
Processing dependent thermal conductivity of nanoporous silica xerogel films
Jain, Anurag, Rogojevic, Svetlana, Ponoth, Shom, Gill, William N., Plawsky, Joel L., Simonyi, Eva, Chen, Shyng-Tsong, Ho, P. S.
Published in Journal of applied physics (01.03.2002)
Published in Journal of applied physics (01.03.2002)
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Journal Article
Three-dimensional wafer-scale copper chemical–mechanical planarization model
Thakurta, Dipto G., Schwendeman, Donald W., Gutmann, Ronald J., Shankar, Sadasivan, Jiang, Lei, Gill, William N.
Published in Thin solid films (01.07.2002)
Published in Thin solid films (01.07.2002)
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Journal Article
Effects of processing history on the modulus of silica xerogel films
Jain, Anurag, Rogojevic, Svetlana, Gill, William N., Plawsky, Joel L., Matthew, Itty, Tomozawa, Minoru, Simonyi, Eva
Published in Journal of applied physics (01.12.2001)
Published in Journal of applied physics (01.12.2001)
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Journal Article
Interactions between nanoporous silica and copper
ROGOJEVIC, Svetlana, JAIN, Anurag, GILL, William N, PLAWSKY, Joel L
Published in Journal of the Electrochemical Society (01.09.2002)
Published in Journal of the Electrochemical Society (01.09.2002)
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Journal Article
Diffusion of Copper in Nanoporous Dielectric Films
Rodriguez, Oscar, Saxena, Ravi, Cho, Woojin, Plawsky, Joel L, Gill, William N
Published in Industrial & engineering chemistry research (02.03.2005)
Published in Industrial & engineering chemistry research (02.03.2005)
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