Energy barriers at grain boundaries dominate charge carrier transport in an electron-conductive organic semiconductor
Vladimirov, I., Kühn, M., Geßner, T., May, F., Weitz, R. T.
Published in Scientific reports (05.10.2018)
Published in Scientific reports (05.10.2018)
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High-Mobility, Ultrathin Organic Semiconducting Films Realized by Surface-Mediated Crystallization
Vladimirov, I, Kellermeier, M, Geßner, T, Molla, Zarah, Grigorian, S, Pietsch, U, Schaffroth, L. S, Kühn, M, May, F, Weitz, R. T
Published in Nano letters (10.01.2018)
Published in Nano letters (10.01.2018)
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A novel technique for MEMS packaging: Reactive bonding with integrated material systems
Braeuer, J., Besser, J., Wiemer, M., Gessner, T.
Published in Sensors and actuators. A. Physical. (01.12.2012)
Published in Sensors and actuators. A. Physical. (01.12.2012)
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Journal Article
Competitive Impact of Nanotube Assembly and Contact Electrodes on the Performance of CNT-based FETs
Toader, M, Hermann, S, Scharfenberg, L, Hartmann, M, Mertig, M, Schulz, S. E, Gessner, T
Published in Journal of physical chemistry. C (12.05.2016)
Published in Journal of physical chemistry. C (12.05.2016)
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A cobalt layer deposition study: Dicobaltatetrahedranes as convenient MOCVD precursor systems
Georgi, C., Hildebrandt, A., Waechtler, T., Schulz, S. E., Gessner, T., Lang, H.
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (01.01.2014)
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (01.01.2014)
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Micro arc welding for electrode gap reduction of high aspect ratio microstructures
Nowack, M., Leidich, S., Reuter, D., Kurth, S., Kuechler, M., Bertz, A., Gessner, T.
Published in Sensors and actuators. A. Physical. (01.12.2012)
Published in Sensors and actuators. A. Physical. (01.12.2012)
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Journal Article
Resistance to Blood Flow in Microvessels In Vivo
Pries, A R, Secomb, T W, Gezner, T, Sperandio, M B, Gross, J F, Gaehtgens, P
Published in Circulation research (01.11.1994)
Published in Circulation research (01.11.1994)
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A MEMS friction vacuum gauge suitable for high temperature environment
Tenholte, D., Kurth, S., Geßner, T., Dötzel, W.
Published in Sensors and actuators. A. Physical. (10.03.2008)
Published in Sensors and actuators. A. Physical. (10.03.2008)
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A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface
Haubold, M., Lin, Y.-C., Frömel, J., Wiemer, M., Esashi, M., Geßner, T.
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2012)
Published in Microsystem technologies : sensors, actuators, systems integration (01.04.2012)
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Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large-scale fabrication
Nestler, J., Morschhauser, A., Hiller, K., Otto, T., Bigot, S., Auerswald, J., Knapp, H. F., Gavillet, J., Gessner, T.
Published in International journal of advanced manufacturing technology (01.03.2010)
Published in International journal of advanced manufacturing technology (01.03.2010)
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Journal Article
Using quantum dot photoluminescence for load detection
Moebius, M., Martin, J., Hartwig, M., Baumann, R. R., Otto, T., Gessner, T.
Published in AIP advances (01.08.2016)
Published in AIP advances (01.08.2016)
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Journal Article
Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers
Wiemer, Maik, Roscher, Frank, Seifert, Tobias, Vogel, Klaus, Ogashiwa, Toshinori, Gessner, Thomas
Published in ECS transactions (01.01.2016)
Published in ECS transactions (01.01.2016)
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Journal Article
Simulation of TaNx deposition by Reactive PVD
WOLF, H, STREITER, R, FRIEDEMANN, M, BELSKY, P, BAKAEVA, O, LETZ, T, GESSNER, T
Published in Microelectronic engineering (01.10.2010)
Published in Microelectronic engineering (01.10.2010)
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Journal Article
Modeling of TDDB in advanced Cu interconnect systems under BTS conditions
Bělský, P., Streiter, R., Wolf, H., Schulz, S.E., Aubel, O., Gessner, T.
Published in Microelectronic engineering (01.04.2012)
Published in Microelectronic engineering (01.04.2012)
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Conference Proceeding
Biocompatibility evaluation of MEMS packaging materials for implantable devices
Baum, M., Haubold, M., Besser, J., Wiemer, M., Gessner, T.
Published in Biomedizinische Technik (07.09.2013)
Published in Biomedizinische Technik (07.09.2013)
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