Panel Level Packaging - Where are the Technology Limits?
Braun, Tanja, Holck, Ole, Obst, Mattis, Voges, Steve, Kahle, Ruben, Bottcher, Lars, Billaud, Mathilde, Stobbe, Lutz, Becker, Karl-Friedrich, Aschenbrenner, Rolf, Voitel, Marcus, Schein, Friedrich-Leonhard, Gerholt, Lutz, Schneider-Ramelow, Martin
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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