IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and μ- & n- TSVs
Sisto, G., Chehab, B., Genneret, B., Baert, R., Chen, R., Weckx, P., Ryckaert, J., Chou, R., van Der Plas, G., Beyne, E., Milojevic, D.
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06.07.2021)
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