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An Efficient Simulation Methodology to Quantify the Impact of Parameter Fluctuations on the Electrothermal Behavior of Multichip SiC Power Modules
Breglio, Giovanni, Borghese, Alessandro, Maresca, Luca, d'Alessandro, Vincenzo, Codecasa, Lorenzo, Catalano, Antonio Pio, Fayyaz, Asad, Riccio, Michele, Castellazzi, Alberto, Irace, Andrea
Published in Materials science forum (19.07.2019)
Published in Materials science forum (19.07.2019)
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