Selective Growth of Diamond in Thermal Vias for GaN HEMTs
Poust, Benjamin, Gambin, Vincent, Sandhu, Rajinder, Smorchkova, Ioulia, Lewis, Gregory, Elmadjian, Raffi, Li, Danny, Geiger, Craig, Heying, Benjamin, Wojtowicz, Mike, Oki, Aaron, Pate, Bradford B., Feygelson, Tatyana, Hobart, Karl
Published in 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2013)
Published in 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2013)
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Conference Proceeding
Advanced Heterogeneous Integration of InP HBT and CMOS Si Technologies
Gutierrez-Aitken, Augusto, Chang-Chien, Patty, Scott, Dennis, Hennig, Kelly, Kaneshiro, Eric, Nam, Peter, Cohen, Neir, Ching, Daniel, Khanh Thai, Oyama, Bert, Zhou, Joe, Geiger, Craig, Poust, Ben, Parlee, Matthew, Sandhu, Randy, Wen Phan, Oki, Aaron, Kagiwada, Reynold
Published in 2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2010)
Published in 2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2010)
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Conference Proceeding
Diamond Materials for GaN HEMT near Junction Heat Removal
Sandhu, R., Gambin, V., Poust, B., Smorchkova, I., Lewis, G., Elmadjian, R., Li, D., Geiger, C., Heying, B., Wojtowicz, M., Oki, A., Feygelson, T., Hobart, K., Bozorg-Grayeli, E., Goodson, K.
Published in 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2012)
Published in 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2012)
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Conference Proceeding
Advanced heterogeneous integration of InP HBT and CMOS Si technologies for high performance mixed signal applications
Gutierrez-Aitken, A., Chang-Chien, P., Wen Phan, Scott, D., Oyama, B., Sandhu, R., Zhou, J., Nam, P., Hennig, K., Parlee, M., Poust, B., Khanh Thai, Geiger, C., Oki, A., Kagiwada, R.
Published in 2009 IEEE MTT-S International Microwave Symposium Digest (01.06.2009)
Published in 2009 IEEE MTT-S International Microwave Symposium Digest (01.06.2009)
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Conference Proceeding
3D Wafer-Scale Integration for RF and Digital Applications
Chang-Chien, Patty, Gutierrez-Aitken, Augusto, Sandhu, Rajinder, Hennig, Kelly, Scott, Dennis, Zhou, Joe, Nam, Peter, Geiger, Craig, Poust, Ben, Parlee, Mattew, Thai, K., Phan, W., Oyama, B.
Published in ECS transactions (2009)
Published in ECS transactions (2009)
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Journal Article
S-MMIC InP HEMT Amplifiers Enabled by the Advanced InP Backside Processes
Zhou, Joe, Mei, Xiaobing, Elmadjian, Raffi, Geiger, Craig, Zeng, Xianglin, Cheung, Chi, Dai, Fred, Johnson, Roosevelt, Luo, Ke, Wang, J., Uyeda, Jansen, Warner, Bryce, Barsky, Mike, Olson, Scott, Dean, William, Radisic, Vesna, Lai, Richard
Published in ECS transactions (28.09.2007)
Published in ECS transactions (28.09.2007)
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Journal Article
3D Wafer-Scale Integration for RF and Digital Applications
Chang-Chien, Patty, Gutierrez-Aitken, Augusto, Hennig, Kelly, Scott, Dennis, Zhou, Joe, Nam, Peter, Geiger, Craig, Parlee, Mattew, Poust, Ben, Sandhu, Rajinder
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Journal Article
METHOD OF FABRICATING HIGH YIELD WAFER LEVEL PACKAGES INTEGRATING MMIC AND MEMS COMPONENTS
CHANGIEN, PATTY, GEIGER, CRAIG, B, KONG, ALVIN, M, TOMQUIST, KELLY, J
Year of Publication 05.03.2008
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Year of Publication 05.03.2008
Patent
S-MMIC InP HEMT Amplifiers Enabled by the Advanced InP Backside Processes
Zhou, Joe, Mei, Xiaobing, Elmadjian, Raffi, Geiger, Craig, Zeng, Xianglin, Cheung, Chi, Dai, Fred, Johnson, Roosevelt, Luo, Ke, Wang, J., Uyeda, Jansen, Warner, Bryce, Barsky, Mike, Olson, Scott, Dean, William, Radisic, Vesna, Lai, Richard
Published in Meeting abstracts (Electrochemical Society) (28.09.2007)
Published in Meeting abstracts (Electrochemical Society) (28.09.2007)
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Journal Article
METHOD OF FABRICATING HIGH YIELD WAFER LEVEL PACKAGES INTEGRATING MMIC AND MEMS COMPONENTS
CHANGIEN, PATTY, GEIGER, CRAIG, B, KONG, ALVIN, M, TOMQUIST, KELLY, J
Year of Publication 04.01.2007
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Year of Publication 04.01.2007
Patent
Method of fabricating high yield wafer level packages integrating MMIC and MEMS components
Chang-Chien, Patty P, Tomquist, Kelly J, Geiger, Craig B, Kong, Alvin M
Year of Publication 27.06.2006
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Year of Publication 27.06.2006
Patent