by Jin, C.Q., Ge, C.H., Xu, G., Wei, Y.X., Ding, Q.P., Zhu, M., Duan, H.B.
Published in Journal of alloys and compounds (05.11.2015)

by Zhu, J.H., Ge, C.H., Zhang, Hong Xia, Li, J.T., Yang, J., Zhu, C.Y.
Published in Applied Mechanics and Materials (01.10.2013)

by Ko, C.H., Kuan, T.M., Kangzhan Zhang, Tsai, G., Seutter, S.M., Wu, C.H., Wang, T.J., Ye, C.N., Chen, H.W., Ge, C.H., Wu, K.H., Lee, W.C.
Published in 2008 Symposium on VLSI Technology (01.06.2008)

by Ko, C.H., Ge, C.H., Chen, C.C., Teo, W.Y., Lin, H.N., Chen, H.W., Kuo, C.W., Yang, M.T., Chen, D.Y., Fu, C.Y., Lee, W.C.
Published in 2007 IEEE International Electron Devices Meeting (01.12.2007)

by Ko, C.H., Ge, C.H., Huang, C.C., Fu, C.Y., Hsu, C.P., Chen, C.H., Chang, C.H., Lu, J.C., Yeo, Y.C., Lee, W.C., Chi, M.H.
Published in IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech) (2005)