by Constable, J.H., Kache, T., Teichmann, H., Muhle, S., Gaynes, M.A.
Published in IEEE transactions on components and packaging technologies (01.06.1999)

by Gaynes, M.A., Lewis, R.H., Saraf, R.F., Roldan, J.M.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1995)

by Shaukatullah, H., Storr, W.R., Hansen, B.J., Gaynes, M.A.
Published in Annual IEEE Semiconductor Thermal Measurement and Management Symposium (1996)

by Shaukatullah, H., Gaynes, M.A., White, L.H.
Published in Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) (1994)

by Shaukatullah, H., Gaynes, M.A.
Published in Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (1994)

by Saraf, R.F., Roldan, J.M., Sambucetti, C.J., Gaynes, M.A., Lewis, R.
Published in Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium (1995)

by Shaukatullah, H., Storr, W.R., Hansen, B.J., Gaynes, M.A.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.12.1996)

by Gaynes, M.A., Shaukatullah, H.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)

by Milkovich, C.S., Gaynes, M.A., Perkins, J.S.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)

by Constable, J.H., Kache, T., Teichmann, H., Muhle, S., Gaynes, M.A.
Published in Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) (1998)

by Shaukatullah, H., Gaynes, M.A., White, L.H.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)