First- and second-level packaging of the z990 processor cage
Winkel, T.-M., Becker, W. D., Harrer, H., Pross, H., Kaller, D., Garben, B., Chamberlin, B. J., Kuppinger, S. A.
Published in IBM journal of research and development (01.05.2004)
Published in IBM journal of research and development (01.05.2004)
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Journal Article
Frequency dependencies of power noise
Garben, B., Frech, R., Supper, J., McAllister, M.F.
Published in IEEE transactions on advanced packaging (01.05.2002)
Published in IEEE transactions on advanced packaging (01.05.2002)
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Journal Article
Conference Proceeding
Novel MCM -MLC technology
Garben, Bernd, Rehm, Simone, Klink, Erich, Thomke, Gisbert, Shutler, William
Year of Publication 29.11.2001
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Year of Publication 29.11.2001
Patent
Method for delta-noise reduction
WINKEL THOMAS-MICHAEL, GARBEN BERND, HARRER HUBERT, HUBER ANDREAS, FRECH ROLAND, KLINK ERICH, KALLER DIERK, BECKER WIREN DALE
Year of Publication 10.08.2004
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Year of Publication 10.08.2004
Patent
Method for delta-noise reduction
Frech, Roland, Garben, Bernd, Harrer, Hubert, Huber, Andreas, Kaller, Dierk, Klink, Erich, Winkel, Thomas-Michael, Becker, Wiren Dale
Year of Publication 10.08.2004
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Year of Publication 10.08.2004
Patent
Evolution of organic chip packaging technology for high speed applications
Klink, E., Garben, B., Huber, A., Kaller, D., Grivet-Talocia, S., Katopis, G.A.
Published in IEEE transactions on advanced packaging (01.02.2004)
Published in IEEE transactions on advanced packaging (01.02.2004)
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Journal Article
Conference Proceeding