New Modelling Off-state TDDB for 130nm to 28nm CMOS nodes
Garba-Seybou, Tidjani, Federspiel, Xavier, Bravaix, Alain, Cacho, Florian
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Current Driven Modeling and SILC Investigation of Oxide Breakdown under Off-state TDDB in 28nm dedicated to RF applications
Garba-Seybou, Tidjani, Bravaix, Alain, Federspiel, Xavier, Hai, Joycelyn, Diouf, Cheikh, Cacho, Florian
Published in 2023 IEEE International Integrated Reliability Workshop (IIRW) (08.10.2023)
Published in 2023 IEEE International Integrated Reliability Workshop (IIRW) (08.10.2023)
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Conference Proceeding
Location of Oxide Breakdown Events under Off-state TDDB in 28nm N-MOSFETs dedicated to RF applications
Garba-Seybou, Tidjani, Federspiel, Xavier, Monsieur, Frederic, Sicre, Mathieu, Cacho, Florian, Hai, Joycelyn, Bravaix, Alain
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Integrated Test Circuit for Off-State Dynamic Drain Stress Evaluation
Hai, J., Cacho, F., Federspiel, X., Garba-Seybou, T., Divay, A., Lauga-Larroze, E., Arnould, J.-D.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Correction to "Universal Dielectric Breakdown Modeling Under Off-State TDDB for Ultra-Scaled Device From 130 nm to 28 nm Nodes and Beyond"
Garba-Seybou, Tidjani, Federspiel, Xavier, Hai, Joycelyn, Diouf, Cheikh, Cacho, Florian, Bravaix, Alain
Published in IEEE transactions on device and materials reliability (01.09.2024)
Published in IEEE transactions on device and materials reliability (01.09.2024)
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Magazine Article
Universal Dielectric Breakdown Modeling Under Off-State TDDB for Ultra-Scaled Device From 130nm to 28nm Nodes and Beyond
Garba-Seybou, Tidjani, Bravaix, Alain, Federspiel, Xavier, Hai, Joycelyn, Diouf, Cheikh, Cacho, Florian
Published in IEEE transactions on device and materials reliability (01.06.2024)
Published in IEEE transactions on device and materials reliability (01.06.2024)
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Magazine Article