Finite element analysis of Sn-Ag-Cu solder joint failure under impact test
Ganran Tang, Bing An, Yiping Wu, Fengshun Wu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Get full text
Conference Proceeding