Wafer level vacuum packaging for MEMS device by solder sealing
Bing An, Gan-ran Tang, Ya-nan Sun, Wei-wen Lu, Yi-ping Wu
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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