by Zeng, Xiao Mei, Lai, Alan, Gan, Chee Lip, Schuh, Christopher A.
Published in Acta materialia (15.04.2019)

by Ze Zhu, Yan-cheong Chan, Fengshun Wu, Chee Lip Gan, Zhong Chen
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)

by Byung Hoon Lee, Mei Zhen Ng, Zinn, Alfred A., Chee Lip Gan
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)

by Tam Lyn Tan, Jesica Gan, Chee Lip Gan, Nam Hwang, Gambino, J.
Published in 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2006)

by Zeng, Xiao Mei, Du, Zehui, Tamura, Nobumichi, Liu, Qing, Schuh, Christopher A., Gan, Chee Lip
Published in Acta materialia (01.08.2017)

by Behera, Rohit Pratyush, Ng, Andrew Yun Ru, Reavley, Matthew Jun-Hui, Du, Zehui, Gan, Chee Lip, Le Ferrand, Hortense
Published in Cell reports physical science (21.08.2024)

by Tay, Yu Shan, Phua, Eric Jian Rong, Chen, Zhong, Gan, Chee Lip
Published in ACS omega (20.09.2022)

by Murugan, Vinod K., Jia, Zhigang, Syaranamual, G.J., Gan, Chee Lip, Huang, Yizhong, Chen, Zhong
Published in Surface & coatings technology (25.08.2016)

by Ho, Terence Yan King, Ng, Andrew Yun Ru, Ye, Pengcheng, Tan, Hui Teng, Lock, Daniel Wen Hao, Du, Zehui, Gan, Chee Lip
Published in Additive manufacturing (05.07.2023)

by Zeng, Xiaomei, Du, Zehui, Schuh, Christopher A., Gan, Chee Lip
Published in MRS communications (01.12.2017)

by Byung Hoon Lee, Mei Zhen Ng, Zinn, Alfred A., Chee Lip Gan
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)

by Du, Zehui, Ye, Pengcheng, Zeng, Xiao Mei, Schuh, Christopher A., Tamura, Nobumichi, Zhou, Xinran, Gan, Chee Lip
Published in Journal of the American Ceramic Society (01.09.2017)

by Yadian, Boluo, Rao, Yuhan, Zhu, Bowen, Liu, Zhifeng, Liu, Qing, Gan, Chee Lip, Chen, Xiaodong, Huang, Yizhong
Published in Materials research bulletin (01.12.2017)

by Nam Hwang, Tam Lyn Tan, Cheng Kuo Cheng, An Yan Du, Chee Lip Gan, Dim Lee Kwong
Published in 2006 European Solid-State Device Research Conference (01.09.2006)

by Lim, Adeline B.Y., Long, Xin, Shen, Lu, Chen, Xi, Ramanujan, R.V., Gan, Chee Lip, Chen, Zhong
Published in Journal of alloys and compounds (15.04.2015)

by Lim, Adeline B. Y., Wei Jian Neo, Yauw, Oranna, Chylak, Bob, Chee Lip Gan, Zhong Chen
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)

by Lim, Adeline B.Y., Boothroyd, Chris B., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong
Published in Microelectronics and reliability (01.08.2016)

by Sasangka, Wardhana A, Gan, Chee Lip, Lai, Donny, Tan, Chuan Seng, Thompson, Carl V
Published in Journal of micromechanics and microengineering (01.03.2015)

by Gonçalves, Rui A., Ku, Joanne W. K., Zhang, Hao, Salim, Teddy, Oo, Guodong, Zinn, Alfred A., Boothroyd, Chris, Tang, Richard M. Y., Gan, Chee Lip, Gan, Yunn-Hwen, Lam, Yeng Ming
Published in ACS applied nano materials (23.09.2022)

by Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip
Published in Small (Weinheim an der Bergstrasse, Germany) (12.08.2013)