Controlled Synthesis of Copper-Silicide Nanostructures
Li, Shaozhou, Cai, Hui, Gan, Chee Lip, Guo, Jun, Dong, Zhili, Ma, Jan
Published in Crystal growth & design (07.07.2010)
Published in Crystal growth & design (07.07.2010)
Get full text
Journal Article
Significant enhancement of UV emission in ZnO nanorods subject to Ga+ ion beam irradiation
Yadian, Boluo, Chen, Rui, Liu, Hai, Sun, Handong, Liu, Qing, Gan, Chee Lip, Kun, Zhou, Zhao, Chunwang, Zhu, Bin, Huang, Yizhong
Published in Nano research (01.06.2015)
Published in Nano research (01.06.2015)
Get full text
Journal Article
Cyanate Ester-Based Encapsulation Material for High-Temperature Applications
Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo
Published in Journal of electronic materials (01.09.2013)
Published in Journal of electronic materials (01.09.2013)
Get full text
Journal Article
A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published in Journal of micromechanics and microengineering (01.09.2013)
Published in Journal of micromechanics and microengineering (01.09.2013)
Get full text
Journal Article
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Made, Riko I, Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H., Lee, Chengkuo
Published in Journal of electronic materials (01.02.2009)
Published in Journal of electronic materials (01.02.2009)
Get full text
Journal Article
Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
Sharif, Ahmed, Lim, Jun zhang, Made, Riko I, Lau, Fu Long, Phua, Eric Jian Rong, Lim, Ju Dy, Wong, Chee Cheong, Gan, Chee Lip, Chen, Zhong
Published in Journal of electronic materials (01.08.2013)
Published in Journal of electronic materials (01.08.2013)
Get full text
Journal Article
Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits
Made, Riko I, Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
Get full text
Journal Article
Conference Proceeding
A flexible polyimide cable for implantable neural probe arrays
Cheng, Ming-Yuan, Park, Woo-Tae, Yu, Aibin, Xue, Rui-Feng, Tan, Kwan Ling, Yu, Daquan, Lee, Sang-Hyun, Gan, Chee Lip, Je, Minkyu
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
Get full text
Journal Article
Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress
Lim, Meng Keong, Lin, Jingyuan, Ee, Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
Published in Microelectronics and reliability (01.08.2012)
Published in Microelectronics and reliability (01.08.2012)
Get full text
Journal Article
Conference Proceeding
A Security Assessment of Protected Execute-Only Firmware in Microcontrollers Through Selective Chemical Engraving
Zeng, Xiaomei, Qing, Liu, Chef, Samuel, Gan, Chee Lip
Published in 2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST) (06.05.2024)
Published in 2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST) (06.05.2024)
Get full text
Conference Proceeding
Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate
Sharma, Gaurav, Chong, Ser Choong, Ebin, Liao, Hui, Cai, Gan, Chee Lip, Kripesh, Vaidyanathan
Published in Thin solid films (26.02.2007)
Published in Thin solid films (26.02.2007)
Get full text
Journal Article
Copper micro and nano particles mixture for 3D interconnections application
Yuan Yuan Dai, Mei Zhen Ng, Anantha, P., Chee Lip Gan, Chuan Seng Tan
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Get full text
Conference Proceeding
Effect of interfacial Fe3O4 nanoparticles on the microstructure and mechanical properties of textured alumina densified by ultrafast high-temperature sintering
Behera, Rohit Pratyush, Andrew Yun Ru Ng, Du, Zehui, Chee Lip Gan, Hortense Le Ferrand
Published in arXiv.org (28.06.2024)
Published in arXiv.org (28.06.2024)
Get full text
Paper
Journal Article
Ultrafast high-temperature sintering of dense and textured alumina
Behera, Rohit Pratyush, Matthew Jun-Hui Reavley, Du, Zehui, Gan Chee Lip, Hortense Le Ferrand
Published in arXiv.org (28.06.2024)
Published in arXiv.org (28.06.2024)
Get full text
Paper
Journal Article
Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices
Tan, Hong Siang, Zee, Bernice, Gan, Chee Lip, Kor, Katherine, Tang, Jiaqi, McKinnon, Mark
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Get full text
Conference Proceeding
Security Evaluation of Microcontrollers: A Case Study in Smart Watches
Zeng, Xiaomei, Liu, Qing, Chua, Chung Tah, Chef, Samuel, Gan, Chee Lip
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Get full text
Conference Proceeding