Additive manufacturing of fine-structured copper alloy by selective laser melting of pre-alloyed Cu-15Ni-8Sn powder
Zhang, Gengming, Chen, Chao, Wang, Xiaojun, Wang, Pengwei, Zhang, Xiaoyong, Gan, Xueping, Zhou, Kechao
Published in International journal of advanced manufacturing technology (01.06.2018)
Published in International journal of advanced manufacturing technology (01.06.2018)
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The preparation of silicon nitride ceramics by gelcasting and pressureless sintering
Zeng, Wenmiao, Gan, Xueping, Li, Zhiyou, Zhou, Kechao
Published in Ceramics international (01.08.2016)
Published in Ceramics international (01.08.2016)
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Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu-Ni-Sn-Mn-Zn Alloy
Zhang, Yufang, Xiao, Zhu, Meng, Xiangpeng, Xiao, Lairong, Pei, Yongjun, Gan, Xueping
Published in Materials (09.02.2023)
Published in Materials (09.02.2023)
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Compression and electromagnetic shielding properties of CNTs reinforced copper foams prepared through electrodeposition
Wang, Congzhen, Gan, Xueping, Tao, Jingmei, Xie, Ming, Yi, Jianhong, Liu, Yichun
Published in Vacuum (01.09.2019)
Published in Vacuum (01.09.2019)
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Correction: Zhang et al. Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu-Ni-Sn-Mn-Zn Alloy. Materials 2023, 16 , 1445
Zhang, Yufang, Xiao, Zhu, Meng, Xiangpeng, Xiao, Lairong, Pei, Yongjun, Gan, Xueping
Published in Materials (08.12.2023)
Published in Materials (08.12.2023)
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Friction and Wear Properties of Copper Matrix Composites with CNTs/Cu Composite Foams as Reinforcing Skeletons
Wang, Congzhen, Wu, Zhong, Li, Fengxian, Gan, Xueping, Tao, Jingmei, Yi, Jianhong, Liu, Yichun
Published in Tribology letters (01.12.2021)
Published in Tribology letters (01.12.2021)
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Role of additives in electroless copper plating using hypophosphite as reducing agent
Gan, Xueping, Zhou, Kechao, Hu, Wenbin, Zhang, Dou
Published in Surface & coatings technology (25.03.2012)
Published in Surface & coatings technology (25.03.2012)
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Electroless copper plating on PET fabrics using hypophosphite as reducing agent
Gan, Xueping, Wu, Yating, Liu, Lei, Shen, Bin, Hu, Wenbin
Published in Surface & coatings technology (01.05.2007)
Published in Surface & coatings technology (01.05.2007)
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RGO reinforced Cu foam with enhanced mechanical and electromagnetic shielding properties
Yan, An, Liu, Yichun, Wu, Zhong, Gan, Xueping, Li, Fengxian, Tao, Jingmei, Li, Caiju, Yi, Jianhong
Published in Journal of materials research and technology (01.11.2022)
Published in Journal of materials research and technology (01.11.2022)
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Evaluation methods for mechanical biocompatibility of hernia repair meshes: respective characteristics, application scope and future perspectives
He, Wei, Cao, Guangxiu, Gan, Xueping, Fan, Yubo, Pei, Baoqing, Li, Xiaoming
Published in Journal of materials research and technology (01.07.2021)
Published in Journal of materials research and technology (01.07.2021)
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A Combination of Enhanced Mechanical and Electromagnetic Shielding Properties of Carbon Nanotubes Reinforced Cu-Ni Composite Foams
Wang, Dan, Wu, Zhong, Li, Fengxian, Gan, Xueping, Tao, Jingmei, Yi, Jianhong, Liu, Yichun
Published in Nanomaterials (Basel, Switzerland) (07.07.2021)
Published in Nanomaterials (Basel, Switzerland) (07.07.2021)
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Interfacial Bonding Improvement through Nickel Decoration on Carbon Nanotubes in Carbon Nanotubes/Cu Composite Foams Reinforced Copper Matrix Composites
Wang, Dan, Yan, An, Liu, Yichun, Wu, Zhong, Gan, Xueping, Li, Fengxian, Tao, Jingmei, Li, Caiju, Yi, Jianhong
Published in Nanomaterials (Basel, Switzerland) (25.07.2022)
Published in Nanomaterials (Basel, Switzerland) (25.07.2022)
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Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent
Gan, Xueping, Wu, Yating, Liu, Lei, Hu, Wenbin
Published in Journal of applied electrochemistry (01.08.2007)
Published in Journal of applied electrochemistry (01.08.2007)
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