Guest editorial: Heterogeneous integration and chiplets interconnection
Zhang, Shuye, Gan, Chong Leong, He, Peng, Paik, Kyung-Wook
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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Journal Article
Technological sustainable materials and enabling in semiconductor memory industry: A review
Gan, Chong Leong, Chung, Min-Hua, Zou, Yung-Sheng, Huang, Chen-Yu, Takiar, Hem
Published in e-Prime (01.09.2023)
Published in e-Prime (01.09.2023)
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Journal Article
Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products
Hsu, Yun-Ting, Zou, Yung-Sheng, Chung, Min-Hua, Gan, Chong-Leong, Venkatraman, Venkatesh, Paul, Anila, Low, Winnie, Che, Faxing
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement
Hsu, Yun-Ting, Zou, Yung-Sheng, Chen, Yi-Yu, Chung, Min-Hua, Gan, Chong-Leong, Macalalad, Fatima, Subramanian, Shriram Harihara
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)
Moideen, Mohammad Zainudeen, Chong Leong Gan
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)
Moideen, Mohammad Zainudeen, Leong Gan, Chong
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging
Liu, Vance, Lin, Sih-Tung, Chang, Esan, Chen, Chien-Min, Gan, Chong Leong
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement
Chen, Joyce, Liu, Vance, Lin, Lewis, Chung, Min, Gan, Chong Leong, Takiar, Hem
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
Flip Chip Process Enablement in IC Memory Stacked Die Package
Huang, Chen-Yu, Chiang, Tsung-Han, Lee, Jungbae, Lin, Kohan, Gan, Chong Leong, Jensen, Travis
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Thin Die Flip Chip Process Enablement for Stacked IC Memory Packages
Huang, Chen-Yu, Lee, Jungbae, Chiang, Tsung-Han, Lin, Kohan, Gan, Chong Leong, Jensen, Travis
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years
Gan, Chong Leong, Hashim, U.
Published in Journal of materials science. Materials in electronics (01.07.2015)
Published in Journal of materials science. Materials in electronics (01.07.2015)
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Journal Article
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
Gan, Chong Leong, Chung, Min-Hua, Lin, Lu-Fu, Huang, Chen-Yu, Takiar, Hem
Published in Journal of materials science. Materials in electronics (01.10.2023)
Published in Journal of materials science. Materials in electronics (01.10.2023)
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Journal Article
Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package
Liu, Vance, Sinha, Koustav, Chen, Chia-Tien, Chen, Yi-Jing, Chen, Yi-Yu, Fan, Richard, Chen, Chien-Ming, Gan, Chong Leong
Published in Journal of materials science. Materials in electronics (01.11.2023)
Published in Journal of materials science. Materials in electronics (01.11.2023)
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Journal Article