Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors
Gao, Y., Sasangka, W.A., Thompson, C.V., Gan, C.L.
Published in Microelectronics and reliability (01.09.2019)
Published in Microelectronics and reliability (01.09.2019)
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Journal Article
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
Heryanto, A., Putra, W.N., Trigg, A., Gao, S., Kwon, W.S., Che, F.X., Ang, X.F., Wei, J., I Made, R., Gan, C.L., Pey, K.L.
Published in Journal of electronic materials (01.09.2012)
Published in Journal of electronic materials (01.09.2012)
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Journal Article
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation
Syaranamual, G.J., Sasangka, W.A., Made, R.I., Arulkumaran, S., Ng, G.I., Foo, S.C., Gan, C.L., Thompson, C.V.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article
Vinyl-Tris-(methoxydiethoxy)silane as an effective and ecofriendly flame retardant for electrolytes in lithium ion batteries
Zhang, H.P., Xia, Q., Wang, B., Yang, L.C., Wu, Y.P., Sun, D.L., Gan, C.L., Luo, H.J., Bebeda, A.W., Ree, T. van
Published in Electrochemistry communications (01.03.2009)
Published in Electrochemistry communications (01.03.2009)
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Journal Article
Real-world clinical effectiveness of second-line sunitinib following immuno-oncology therapy in patients with metastatic renal cell carcinoma
Wells, J.C., Dudani, S., Gan, C.L., Stukalin, I., Azad, A., Liow, E., Donskov, F., Yuasa, T., Pal, S., De Velasco, G., Wood, L., Hansen, A., Beuselinck, B., Kollmannsberger, C., Powles, T., Mcgregor, B., Duh, M.S., Huynh, L., Heng, D.Y.C.
Published in European urology open science (Online) (01.07.2020)
Published in European urology open science (Online) (01.07.2020)
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Journal Article
Complex temperature mosaics across space and time in estuaries: implications for current and future nursery function for Pacific salmon
Gross, Phoebe L., Gan, Julian C.L., Scurfield, Daniel J., Frank, Cory, Frank, Cedar, McLean, Caelan, Bob, Chris, Moore, Jonathan W.
Published in Frontiers in Marine Science (27.11.2023)
Published in Frontiers in Marine Science (27.11.2023)
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Journal Article
Self-aligned metal capping layers for copper interconnects using electroless plating
Gambino, J., Wynne, J., Gill, J., Mongeon, S., Meatyard, D., Lee, B., Bamnolker, H., Hall, L., Li, N., Hernandez, M., Little, P., Hamed, M., Ivanov, I., Gan, C.L.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Journal Article
Conference Proceeding
Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package
Kor, H.B., Liu, Q., Gan, C.L.
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
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Conference Proceeding
Investigation on memory package crack and prevention under temperature cycling test
Che, Fa Xing, Ong, Yeow Chon, Ng, Hong Wan, Gan, C.L., Kumar, Gokul
Published in Materials science in semiconductor processing (01.09.2024)
Published in Materials science in semiconductor processing (01.09.2024)
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Journal Article
Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
Tay, Y.S., Yang, L., Zhang, H., Kor, H.B., Zhang, L., Liu, H., Gill, V., Lambourne, A., Li, K.H.H., Chen, Z., Gan, C.L.
Published in Microelectronics and reliability (01.11.2023)
Published in Microelectronics and reliability (01.11.2023)
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Journal Article
425P The impact of obesity on treatment outcomes in patients with solid tumour malignancies treated with first-line (1L) immuno-oncology (IO) agents
Gan, C.L., Meyers, D.E., Stukalin, I., Dudani, S., Dolter, S., Grosjean, H.A.I., Ewanchuk, B.W., Goutam, S., Sander, M., Wells, J.C., Pabani, A., Cheng, T., Yuasa, T., Morris, D., Kanesvaran, R., Pal, S.K., Wood, L.A., Donskov, F., Choueiri, T.K., Heng, D.Y.C.
Published in Annals of oncology (01.11.2020)
Published in Annals of oncology (01.11.2020)
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Journal Article
1046P Outcomes of patients with solid tumour malignancies treated with first-line (1L) immuno-oncology (IO) agents who do not meet eligibility criteria for clinical trials
Gan, C.L., Stukalin, I., Meyers, D.E., Dudani, S., Grosjean, H.A.I., Dolter, S., Ewanchuk, B.W., Goutam, S., Sander, M., Wells, J.C., Pabani, A., Cheng, T., Monzon, J., Morris, D., Basappa, N.S., Pal, S.K., Wood, L.A., Donskov, F., Choueiri, T.K., Heng, D.Y.C.
Published in Annals of oncology (01.09.2020)
Published in Annals of oncology (01.09.2020)
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Journal Article
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress
Tan, H.T., Gao, Y., Syaranamual, G.J., Sasangka, W.A., Foo, S.C., Lee, K.H., Arulkumaran, S., Ng, G.I., Thompson, C.V., Gan, C.L.
Published in Microelectronics and reliability (01.11.2023)
Published in Microelectronics and reliability (01.11.2023)
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Journal Article
Effects of voltage stress on the single event upset (SEU) response of 65nm flip flop
Chua, C.T., Ong, H.G., Sanchez, K., Perdu, P., Gan, C.L.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors
Sasangka, W.A., Gao, Y., Gan, C.L., Thompson, C.V.
Published in Microelectronics and reliability (01.09.2018)
Published in Microelectronics and reliability (01.09.2018)
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Journal Article
Unsupervised learning for signal mapping in dynamic photon emission
Chef, S., Jacquir, S., Sanchez, K., Perdu, P., Binczak, S., Gan, C.L.
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop
Chua, C.T., Ong, H.G., Sanchez, K., Perdu, P., Gan, C.L.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article