by Gan, C. L., Hashim, U.
Published in Journal of materials science. Materials in electronics (01.08.2013)

by Gan, C. L., Classe, F. C., Chan, B. L., Hashim, U.
Published in Journal of electronic materials (01.04.2014)

by Gan, C L, Hashim, U
Published in Journal of electronic packaging (01.06.2013)

by Gan, C. L., Hashim, U.
Published in Journal of materials science. Materials in electronics (01.11.2014)

by Hashim, U., Chan, B. L., Ng, E. K., Gan, C. L., Classe, F. C.
Published in Journal of nanomaterials (01.01.2012)

by Wang, B., Qu, Q.T., Xia, Q., Wu, Y.P., Li, X., Gan, C.L., van Ree, T.
Published in Electrochimica acta (30.12.2008)

by Kwuanjai, T., Classe, F. C., Chan, B. L., Ng, E. K., Gan, C. L., Hashim, U.
Published in Journal of nanomaterials (01.01.2013)

by Gan, C. L., Classe, F. C., Chan, B. L., Hashim, U.
Published in Gold Bulletin (01.09.2014)

by Gambino, J., Wynne, J., Gill, J., Mongeon, S., Meatyard, D., Lee, B., Bamnolker, H., Hall, L., Li, N., Hernandez, M., Little, P., Hamed, M., Ivanov, I., Gan, C.L.
Published in Microelectronic engineering (01.11.2006)

by Gan, C. L., Huang, Chen Yu, Zou, Yung Sheng, Chung, Min Hua, Takiar, Hem
Published in Journal of materials science. Materials in electronics (01.10.2023)

by Zeng, X M, Liu, Q, Tay, J Y, Chew, K Y, Cheah, J, Gan, C L
Published in Nanotechnology (26.11.2021)

by Che, F. X., Putra, W. N., Heryanto, A., Trigg, Alastair, Zhang, Xiaowu, Gan, C. L.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2013)

by Lau, F.L., I Made, Riko, Putra, W.N., Lim, J.Z., Nachiappan, V.C., Aw, J.L., Gan, C.L.
Published in Microelectronics and reliability (01.09.2013)

by Gan, C.L., Yang, Z., Salahia, G., Halpin, S., Nair, S.
Published in Clinical radiology (01.03.2021)

by Lim, M.K., Chouliaras, V.A., Gan, C.L., Dwyer, V.M.
Published in Microelectronics and reliability (01.09.2013)

by Gan, C.L., O'Sullivan, M.J., Metzler-Baddeley, C., Halpin, S.
Published in Clinical radiology (01.11.2017)

by Heryanto, A., Putra, W.N., Trigg, A., Gao, S., Kwon, W.S., Che, F.X., Ang, X.F., Wei, J., I Made, R., Gan, C.L., Pey, K.L.
Published in Journal of electronic materials (01.09.2012)

by Tay, J. Y., Cheah, J., Chef, S., Zeng, X. M., Liu, Q., Gan, C. L
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)

by Infante, F., Perdu, P., Kor, H.B., Gan, C.L., Lewis, D.
Published in Microelectronics and reliability (01.09.2011)

by Sasangka, W. A., Syaranamual, G. J., Made, R. I., Thompson, C. V., Gan, C. L.
Published in AIP advances (01.09.2016)