Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
Hagberg, Juha, Nousiainen, Olli, Putaala, Jussi, Salmela, Olli, Raumanni, Juha, Rahko, Matti, Kangasvieri, Tero, Jääskeläinen, Jussi, Galkin, Timo, Jantunen, Heli
Published in Microelectronics and reliability (01.06.2020)
Published in Microelectronics and reliability (01.06.2020)
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Journal Article
Experimental liquid cooled base station
Nortershauser, David, Le Masson, Stephane, Volkov, Topi, Galkin, Timo, Amper, Oskari, Huttunen, Jari
Published in 2016 IEEE International Telecommunications Energy Conference (INTELEC) (01.10.2016)
Published in 2016 IEEE International Telecommunications Energy Conference (INTELEC) (01.10.2016)
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Conference Proceeding
Small wind turbines on pylon powering base transceiver stations: A study of radio interactions
Tran Vu La, Le Pennec, Francois, Aubree, Marc, Nuaymi, Loutfi, Galkin, Timo, Elenga, Serge
Published in 2014 IEEE 36th International Telecommunications Energy Conference (INTELEC) (01.09.2014)
Published in 2014 IEEE 36th International Telecommunications Energy Conference (INTELEC) (01.09.2014)
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Conference Proceeding
Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Osterlund, Elmeri, Vuorinen, Vesa, Jokilahti, Juha, Galkin, Timo, Salmela, Olli, Paulasto-Krockel, Mervi
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Transient hygrothermal behaviour of portable electronics
Punch, J., Grimes, R., Heaslip, G., Galkin, T., Vakevainen, K., Kyyhkynen, V., Elonen, E.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding
Power Module Interconnection Reliability in BTS Applications
Putaala, Jussi, Hagberg, Juha, Kangasvieri, Tero, Raumanni, Juha, Salmela, Olli, Rahko, Matti, Jaaskelainen, Jussi, Galkin, Timo, Nousiainen, Olli, Jantunen, Heli
Published in IEEE transactions on device and materials reliability (01.09.2019)
Published in IEEE transactions on device and materials reliability (01.09.2019)
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Magazine Article
An investigation of sealant materials for display modules subjected to temperature and humidity conditions
Griffin, P., Leahy, J.J., Punch, J., Galkin, T., Elonen, E., Rusanen, O.
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
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Conference Proceeding