Deep Trench Isolation and through Silicon via Wetting Characterization by High-Frequency Acoustic Reflectometry
Garnier, Philippe, Toubal, M., Gabette, L., Broussous, Lucile, Carlier, J., Virgilio, C., Thomy, V., Nongaillard, B., Campistron, P., Besson, Pascal
Published in Solid state phenomena (01.01.2016)
Published in Solid state phenomena (01.01.2016)
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Journal Article
Nearly Anhydrous Undissociated HF for the Removal of Hf / Ta / Zr Based Polymers after Plasma Etch, Selectively to Aluminum
Cazes, Marine, Broussous, Lucile, Garnier, Philippe, Pizzetti, Christian, Gabette, Laurence, Besson, Pascal
Published in ECS transactions (15.08.2017)
Published in ECS transactions (15.08.2017)
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Journal Article
Ruthenium Wet Etch on 200mm MEMS Wafers with Sodium Hypochlorite
Segaud, Roselyne, Gabette, Laurence, Louveau, Olivier, Besson, P.
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Journal Article
Gold Wet Etch Optimization on 200mm Substrates for MEMS Applications
Gabette, Laurence, Segaud, Roselyne, Fadloun, Sabrina, Avale, Xavier, Besson, P.
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Journal Article
Mechanical and Electrical Analysis of Strained Liner Effect in 35 nm Fully Depleted Silicon-on-Insulator Devices with Ultra Thin Silicon Channels
Gallon, C., Fenouillet-Beranger, C., Denorme, S., Boeuf, F., Fiori, V., Loubet, N., Vandooren, A., Kormann, T., Broekaart, M., Gouraud, P., Leverd, F., Imbert, G., Chaton, C., Laviron, C., Gabette, L., Vigilant, F., Garnier, P., Bernard, H., Tarnowka, A., Pantel, R., Pionnier, F., Jullian, S., Cristoloveanu, S., Skotnicki, T.
Published in Japanese Journal of Applied Physics (01.04.2006)
Published in Japanese Journal of Applied Physics (01.04.2006)
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Journal Article
Mechanical and electrical analysis of a strained liner effect in 35nm FDSOI devices with ultra-thin silicon channels
C., Gallon, C., Fenouillet-Beranger, S., Denorme, F., Boeuf, V., Fiori, N., Loubet, T., Kormann, M., Broekaart, P., Gouraud, F., Leverd, G., Imbert, C., Chaton, C., Laviron, L., Gabette, F., Vigilanti, P., Garnier, H., Bernard, A., Tarnowka, A., Vandooren, R., Pantel, F., Pionnier, S., Jullian, S., Cr, Skotnicki, T.
Published in Japanese Journal of Applied Physics (2006)
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Published in Japanese Journal of Applied Physics (2006)
Journal Article
Mechanical and electrical analysis of strained liner effect in 35 nm fully depleted silicon-on-insulator devices with ultra thin silicon channels
Gallon, C., Fenouillet-Beranger, C., Denorme, S., Boeuf, F., Fiori, V., Loubet, N., Vandooren, A., Kormann, T., Broekaart, M., Gouraud, P., Leverd, F., Imbert, G., Chaton, C., Laviron, C., Gabette, L., Vigilant, F., Garnier, P., Bernard, H., Tarnowka, A., Pantel, R., Pionnier, F., Jullian, Sophie, Cristoloveanu, S., Skotnicki, T.
Published in Japanese Journal of Applied Physics (2006)
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Published in Japanese Journal of Applied Physics (2006)
Journal Article
Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
Coudrain, P., Colonna, J.-P, Aumont, C., Garnier, G., Chausse, P., Segaud, R., Vial, K., Jouve, A., Mourier, T., Magis, T., Besson, P., Gabette, L., Brunet-Manquat, C., Allouti, N., Laviron, C., Cheramy, S., Saugier, E., Pruvost, J., Farcy, A., Hotellier, N.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
0.525/spl mu/m/sup 2/ 6T-SRAM bit cell using 45nm fully-depleted SOI CMOS technology with metal gate, high k dielectric and elevated source/drain on 300mm wafers
Vandooren, A., Hobbs, C., Faynot, O., Perreau, P., Denorme, S., Fenouillet-Beranger, C., Gallon, C., Morin, C., Zauner, A., lmbert, G., Bernard, H., Garnier, P., Gabette, L., Broekaart, M., Aminpur, M., Barnola, S., Loubet, N., Dutartre, D., Korman, T., Chabanne, G., Martin, F., Le Tiec, Y., Gierczynski, N., Smith, S., Laviron, C., Bidaud, M., Pouilloux, I., Bensahel, D., Skotnicki, T., Mingam, H., Wild, A.
Published in 2005 IEEE International SOI Conference Proceedings (2005)
Published in 2005 IEEE International SOI Conference Proceedings (2005)
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Conference Proceeding
Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
Vial, K., Jouve, A., Rolland, E., Coudrain, P., Aumont, C., Foumel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Laviron, C., Cheramy, S., Sillon, N.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
Jouve, A., Vial, K., Rolland, E., Coudrain, P., Aumont, C., Laviron, C., Fournel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Donche, C., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Cheramy, S., Sillon, N.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
3D Integration challenges today from technological toolbox to industrial prototypes
Mourier, T., Ribiere, C., Romero, G., Gottardi, M., Allouti, N., Eleouet, R., Roman, A., Magis, T., Minoret, S., Ratin, C., Scevola, D., Dupuy, E., Martin, B., Gabette, L., Marseilhan, D., Enot, T., Pellat, M., Loup, V., Segaud, R., Feldis, H., Charpentier, A., Bally, J. P., Assous, M., Charbonnier, I., Laviron, C., Coudrain, P., Sillon, N.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Ultra-fine pitch redistribution for 3D interposer
Segaud, R., Aumont, C., Eleouet, R., Allouti, N., Mourier, T., Gabette, L., Minoret, S., Magis, T., Roman, A., Hida, R., Ratin, C., Lachal, L., Delachanal, S., Cordini, M. L., Nardi, P., Feldis, H., Charpentier, A., Chausse, P., Laviron, C., Cheramy, S.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding