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Year of Publication 10.11.2023
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High-accuracy FPC folding strength testing device
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Year of Publication 10.11.2023
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Year of Publication 10.11.2023
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Packaging substrate structure with built-in chip
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Year of Publication 10.11.2023
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Year of Publication 10.11.2023
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Flame-retardant and heat-insulating epoxy IC carrier plate
LIU CHANGSONG, ZHA HONGPING, WEN WEIFENG, GUO DAWEN, LIU XUAN, WANG HONG
Year of Publication 03.11.2023
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Year of Publication 03.11.2023
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HDI circuit board edge V-cut forming method with high processing precision
LIU CHANGSONG, CHEN SHENGXIN, WEN WEIFENG, GUO DAWEN, LIU XUAN, LI TANG
Year of Publication 21.07.2023
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Year of Publication 21.07.2023
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