Reliability Investigation of Large GaAs Pixel Detectors Flip-Chip-Bonded on Si Readout Chips
Klein, M, Hutter, M, Engelmann, G, Fritzsch, T, Oppermann, H, Dietrich, L, Wolf, M J, Bramer, B, Dudek, R, Reichl, H
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
High aspect ratio TSV copper filling with different seed layers
Wolf, M.J., Dretschkow, T., Wunderle, B., Jurgensen, N., Engelmann, G., Ehrmann, O., Uhlig, A., Michel, B., Reichl, H.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Electromigration in electroplated gold micro contacts
Kleff, J., Engelmann, G., Oppermann, H., Reichl, H.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Verfahren zum Herstellen einer nanoporösen Schicht
Wolf, Jürgen, Oppermann, Hermann, Dr, Dietrich, Lothar, Engelmann, Gunter, Dr
Year of Publication 04.04.2019
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Year of Publication 04.04.2019
Patent
Solder metallization i.e. gold-tin solder metallization, producing method for e.g. silicon substrate, involves removing current transport layer of metallization compound outside contact surface
OPPERMANN, HERMANN, ENGELMANN, GUNTER, HUTTER, MATTHIAS, TOEPPER, MICHAEL
Year of Publication 16.07.2009
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Year of Publication 16.07.2009
Patent
Microstructure or nanostructure producing method for substrate, involves connecting composite including template, outlet layer and barrier layer, with carrier, removing template such that metallic columns remain on carrier at contact point
OPPERMANN, HERMANN, ENGELMANN, GUNTER, WOLF, JUERGEN, SCHMIDT, RALF, JORDAN, RAFAEL
Year of Publication 04.12.2008
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Year of Publication 04.12.2008
Patent
ELECTRICAL CONNECTOR
FRANK SCHROER, HEIKO SCHUBERT, WOLFGANG MOSCHNER, GUNTER ENGELMANN, FRANZ HAFNER
Year of Publication 09.07.2004
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Year of Publication 09.07.2004
Patent
Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
OPPERMANN, HERMANN, ENGELMANN, GUNTER, WOLF, JÜRGEN M, REICHL, HERBERT, DR
Year of Publication 20.11.2014
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Year of Publication 20.11.2014
Patent
Plug connector
SCHOCH VOLKER, ENGELMANN GUNTER, WELLMANN CHRISTA, HARTING DIETMAR, SCHREIER STEPHAN
Year of Publication 28.08.2001
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Year of Publication 28.08.2001
Patent
Electrical or electronic component e.g. integrated circuit, has metallic contact layer arranged on solid metallic socket and forming structure e.g. micro structure, including elevations and slots with height of specific value
OPPERMANN, HERMANN, ENGELMANN, GUNTER, WOLF, JUERGEN M, REICHL, HERBERT
Year of Publication 26.08.2010
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Year of Publication 26.08.2010
Patent