Characterization of copper voids in damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Corum, D.L., Oestreich, S., Sherman, K., Lin, J.H., Fiordalice, R.
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
Published in IEEE transactions on semiconductor manufacturing (01.11.2004)
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Journal Article
Characterization of copper voids in dual damascene processes
Guldi, R.L., Shaw, J.B., Ritchison, J., Oestreich, S., Davis, K., Fiordalice, R.
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
Published in 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) (2002)
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Conference Proceeding
Strategy and metrics for wafer handling automation in legacy semiconductor fab
Guldi, R.L., Paradis, D.E., Whitfield, M.T., Poag, F.D., Jensen, D.P.
Published in IEEE transactions on semiconductor manufacturing (01.02.1999)
Published in IEEE transactions on semiconductor manufacturing (01.02.1999)
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Journal Article
Conference Proceeding
By-die-exposure for patterning of holes in edge die
Detweiler, Shangting, Chatterjee, Basab, Atkinson, Chris D, Guldi, Richard L
Year of Publication 25.09.2012
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Year of Publication 25.09.2012
Patent
By-die-exposure for patterning of holes in edge die
GULDI RICHARD L, ATKINSON CHRIS D, DETWEILER SHANGTING, CHATTERJEE BASAB
Year of Publication 25.09.2012
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Year of Publication 25.09.2012
Patent